Integrated Circuits (ICs)

AX2000-FG896M

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FPGA AXCELERATOR FAMILY 1.06M GATES 21504 CELLS 649MHZ 0.15UM TECHNOLOGY 1.5V 896-PIN FBGA TRAY

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Integrated Circuits (ICs)

Active

FPGA AXCELERATOR FAMILY 1.06M GATES 21504 CELLS 649MHZ 0.15UM TECHNOLOGY 1.5V 896-PIN FBGA TRAY

Technical Specifications

Parameters and characteristics for this part

High speed Antifuse FPGAs

Part	Total RAM Bits	Mounting Type	Voltage - Supply [Max]	Voltage - Supply [Min]	Number of LABs/CLBs	Number of I/O	Supplier Device Package	Package / Case	Operating Temperature [Max]	Operating Temperature [Min]	Number of Gates [custom]	Operating Temperature [Max]	Operating Temperature [Min]
Microchip Technology AX2000-1FG896	294912	Surface Mount	1.575 V	1.425 V	32256	586	896-FBGA (31x31)	896-BGA	70 °C	0 °C	2000000
Microchip Technology AX2000-1CGS624M	294912	Through Hole	1.575 V	1.425 V	32256		624-CCGA (32.5x32.5)	624-BCCGA			2000000	125 °C	-55 °C
Microchip Technology AX2000-FGG896	294912	Surface Mount	1.575 V	1.425 V	32256	586	896-FBGA (31x31)	896-BGA	70 °C	0 °C	2000000
Microchip Technology AX2000-2FG896	294912	Surface Mount	1.575 V	1.425 V	32256	586	896-FBGA (31x31)	896-BGA	70 °C	0 °C	2000000
Microchip Technology AX2000-2FGG896I	294912	Surface Mount	1.575 V	1.425 V	32256	586	896-FBGA (31x31)	896-BGA	85 °C	-40 °C	2000000
Microchip Technology AX2000-2FG896I	294912	Surface Mount	1.575 V	1.425 V	32256	586	896-FBGA (31x31)	896-BGA	85 °C	-40 °C	2000000
Microchip Technology AX2000-1FG896I	294912	Surface Mount	1.575 V	1.425 V	32256	586	896-FBGA (31x31)	896-BGA	85 °C	-40 °C	2000000
Microchip Technology AX2000-1LG624M	294912	Surface Mount	1.575 V	1.425 V	32256		624-CLGA (32.5x32.5)	624-BCLGA			2000000	125 °C	-55 °C
Microchip Technology AX2000-1FGG1152M	294912	Surface Mount	1.575 V	1.425 V	32256	684	1152-FPBGA (35x35)	1152-BGA			2000000	125 °C	-55 °C
Microchip Technology AX2000-FG896M	294912	Surface Mount	1.575 V	1.425 V	32256	586	896-FBGA (31x31)	896-BGA			2000000	125 °C	-55 °C

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General part information

Axcelerator®

offers high performance and unprecedented design security at density of 2 million equivalent system gates.These

devices have several system-level features, such as embedded SRAM (with

Technical documentation and resources