Technical Specifications
Parameters and characteristics for this part
| Specification | W25M02GVZEIR |
|---|---|
| Access Time | 7 ns |
| Clock Frequency | 104 MHz |
| Memory Depth | 256 M |
| Memory Format | FLASH |
| Memory Interface (Type) | SPI - Quad I/O |
| Memory Size | 2 Gbit |
| Memory Type | Non-Volatile |
| Memory Width | 8 bit |
| Mounting Type | Surface Mount |
| Operating Temperature (Max) | 85 °C |
| Operating Temperature (Min) | -40 °C |
| Package / Case | 8-WDFN Exposed Pad |
| Package Length | 8 mm |
| Package Name | 8-WSON |
| Package Width | 6 mm |
| Technology | FLASH - NAND (SLC) |
| Voltage - Supply (Maximum) | 3.6 V |
| Voltage - Supply (Minimum) | 2.7 V |
| Write Cycle Time - Page | 700 µs |
| Write Cycle Time - Word | 700 µs |
| Part | Package Name | Write Cycle Time - Word | Write Cycle Time - Page | Memory Size | Operating Temperature (Max) | Operating Temperature (Min) | Voltage - Supply (Maximum) | Voltage - Supply (Minimum) | Clock Frequency | Memory Depth | Memory Width | Mounting Type | Memory Type | Technology | Memory Format | Memory Interface (Type) | Access Time | Package Length | Package Width | Package / Case |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 Winbond Electronics | 16-SOIC | 700 µs | 700 µs | 2 Gbit | 105 °C | -40 °C | 3.6 V | 2.7 V | 104 MHz | 256 M | 8 bit | Surface Mount | Non-Volatile | FLASH - NAND (SLC) | FLASH | SPI - Quad I/O | 7 ns | 0.295 in | 7.5 mm | |
Winbond Electronics | 8-WSON | 700 µs | 700 µs | 2 Gbit | 105 °C | -40 °C | 3.6 V | 2.7 V | 104 MHz | 256 M | 8 bit | Surface Mount | Non-Volatile | FLASH - NAND (SLC) | FLASH | SPI - Quad I/O | 7 ns | 8 mm | 6 mm | 8-WDFN Exposed Pad |
Winbond Electronics | 16-SOIC | 700 µs | 700 µs | 2 Gbit | 105 °C | -40 °C | 3.6 V | 2.7 V | 104 MHz | 256 M | 8 bit | Surface Mount | Non-Volatile | FLASH - NAND (SLC) | FLASH | SPI - Quad I/O | 7 ns | 0.295 in | 7.5 mm | |
 Winbond Electronics | 24-TFBGA | 700 µs | 700 µs | 2 Gbit | 85 °C | -40 °C | 3.6 V | 2.7 V | 104 MHz | 256 M | 8 bit | Surface Mount | Non-Volatile | FLASH - NAND (SLC) | FLASH | SPI | 8 mm | 6 mm | 24-TBGA | |
Winbond Electronics | 8-WSON | 700 µs | 700 µs | 2 Gbit | 85 °C | -40 °C | 3.6 V | 2.7 V | 104 MHz | 256 M | 8 bit | Surface Mount | Non-Volatile | FLASH - NAND (SLC) | FLASH | SPI - Quad I/O | 7 ns | 8 mm | 6 mm | 8-WDFN Exposed Pad |
Winbond Electronics | 16-SOIC | 700 µs | 700 µs | 2 Gbit | 85 °C | -40 °C | 3.6 V | 2.7 V | 104 MHz | 256 M | 8 bit | Surface Mount | Non-Volatile | FLASH - NAND (SLC) | FLASH | SPI - Quad I/O | 7 ns | 0.295 in | 7.5 mm | |
 Winbond Electronics | 24-TFBGA | 700 µs | 700 µs | 2 Gbit | 85 °C | -40 °C | 3.6 V | 2.7 V | 104 MHz | 256 M | 8 bit | Surface Mount | Non-Volatile | FLASH - NAND (SLC) | FLASH | SPI | 8 mm | 6 mm | 24-TBGA | |
Winbond Electronics | 24-TFBGA | 700 µs | 700 µs | 2 Gbit | 105 °C | -40 °C | 3.6 V | 2.7 V | 104 MHz | 256 M | 8 bit | Surface Mount | Non-Volatile | FLASH - NAND (SLC) | FLASH | SPI - Quad I/O | 7 ns | 8 mm | 6 mm | 24-TBGA |
Winbond Electronics | 24-TFBGA | 700 µs | 700 µs | 2 Gbit | 105 °C | -40 °C | 3.6 V | 2.7 V | 104 MHz | 256 M | 8 bit | Surface Mount | Non-Volatile | FLASH - NAND (SLC) | FLASH | SPI - Quad I/O | 7 ns | 8 mm | 6 mm | 24-TBGA |
Winbond Electronics | 24-TFBGA | 700 µs | 700 µs | 2 Gbit | 85 °C | -40 °C | 3.6 V | 2.7 V | 104 MHz | 256 M | 8 bit | Surface Mount | Non-Volatile | FLASH - NAND (SLC) | FLASH | SPI - Quad I/O | 7 ns | 8 mm | 6 mm | 24-TBGA |
Pricing
Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly
| Distributor | Package | Quantity | $ | Updated |
|---|---|---|---|---|
CAD
3D models and CAD resources for this part
Description
General part information
W25M02 Series
FLASH - NAND (SLC) Memory IC 2Gbit SPI - Quad I/O 104 MHz 7 ns 8-WSON (8x6)
Documents
Technical documentation and resources