W25M02 Series
Manufacturer: Winbond Electronics
IC FLASH 2GBIT SPI/QUAD 16SOIC
| Part | Package Name | Write Cycle Time - Word | Write Cycle Time - Page | Memory Size | Operating Temperature (Max) | Operating Temperature (Min) | Voltage - Supply (Maximum) | Voltage - Supply (Minimum) | Clock Frequency | Memory Depth | Memory Width | Mounting Type | Memory Type | Technology | Memory Format | Memory Interface (Type) | Access Time | Package Length | Package Width | Package / Case |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Winbond Electronics | 16-SOIC | 700 µs | 700 µs | 2 Gbit | 105 °C | -40 °C | 3.6 V | 2.7 V | 104 MHz | 256 M | 8 bit | Surface Mount | Non-Volatile | FLASH - NAND (SLC) | FLASH | SPI - Quad I/O | 7 ns | 0.295 in | 7.5 mm | |
Winbond Electronics | 8-WSON | 700 µs | 700 µs | 2 Gbit | 105 °C | -40 °C | 3.6 V | 2.7 V | 104 MHz | 256 M | 8 bit | Surface Mount | Non-Volatile | FLASH - NAND (SLC) | FLASH | SPI - Quad I/O | 7 ns | 8 mm | 6 mm | 8-WDFN Exposed Pad |
Winbond Electronics | 16-SOIC | 700 µs | 700 µs | 2 Gbit | 105 °C | -40 °C | 3.6 V | 2.7 V | 104 MHz | 256 M | 8 bit | Surface Mount | Non-Volatile | FLASH - NAND (SLC) | FLASH | SPI - Quad I/O | 7 ns | 0.295 in | 7.5 mm | |
Winbond Electronics | 24-TFBGA | 700 µs | 700 µs | 2 Gbit | 85 °C | -40 °C | 3.6 V | 2.7 V | 104 MHz | 256 M | 8 bit | Surface Mount | Non-Volatile | FLASH - NAND (SLC) | FLASH | SPI | 8 mm | 6 mm | 24-TBGA | |
Winbond Electronics | 8-WSON | 700 µs | 700 µs | 2 Gbit | 85 °C | -40 °C | 3.6 V | 2.7 V | 104 MHz | 256 M | 8 bit | Surface Mount | Non-Volatile | FLASH - NAND (SLC) | FLASH | SPI - Quad I/O | 7 ns | 8 mm | 6 mm | 8-WDFN Exposed Pad |
Winbond Electronics | 16-SOIC | 700 µs | 700 µs | 2 Gbit | 85 °C | -40 °C | 3.6 V | 2.7 V | 104 MHz | 256 M | 8 bit | Surface Mount | Non-Volatile | FLASH - NAND (SLC) | FLASH | SPI - Quad I/O | 7 ns | 0.295 in | 7.5 mm | |
Winbond Electronics | 24-TFBGA | 700 µs | 700 µs | 2 Gbit | 85 °C | -40 °C | 3.6 V | 2.7 V | 104 MHz | 256 M | 8 bit | Surface Mount | Non-Volatile | FLASH - NAND (SLC) | FLASH | SPI | 8 mm | 6 mm | 24-TBGA | |
Winbond Electronics | 24-TFBGA | 700 µs | 700 µs | 2 Gbit | 105 °C | -40 °C | 3.6 V | 2.7 V | 104 MHz | 256 M | 8 bit | Surface Mount | Non-Volatile | FLASH - NAND (SLC) | FLASH | SPI - Quad I/O | 7 ns | 8 mm | 6 mm | 24-TBGA |
Winbond Electronics | 24-TFBGA | 700 µs | 700 µs | 2 Gbit | 105 °C | -40 °C | 3.6 V | 2.7 V | 104 MHz | 256 M | 8 bit | Surface Mount | Non-Volatile | FLASH - NAND (SLC) | FLASH | SPI - Quad I/O | 7 ns | 8 mm | 6 mm | 24-TBGA |
Winbond Electronics | 24-TFBGA | 700 µs | 700 µs | 2 Gbit | 85 °C | -40 °C | 3.6 V | 2.7 V | 104 MHz | 256 M | 8 bit | Surface Mount | Non-Volatile | FLASH - NAND (SLC) | FLASH | SPI - Quad I/O | 7 ns | 8 mm | 6 mm | 24-TBGA |