W25M02 Series
Manufacturer: Winbond Electronics
IC FLASH 2GBIT SPI/QUAD 16SOIC
| Part | Supplier Device Package | Write Cycle Time - Word, Page | Memory Size | Operating Temperature [Min] | Operating Temperature [Max] | Voltage - Supply [Max] | Voltage - Supply [Min] | Clock Frequency | Memory Organization | Mounting Type | Memory Type | Technology | Memory Format | Memory Interface | Access Time | Package / Case | Package / Case | Package / Case |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Winbond Electronics | 16-SOIC | 700 µs | 2 Gbit | -40 °C | 105 °C | 3.6 V | 2.7 V | 104 MHz | 256 M | Surface Mount | Non-Volatile | FLASH - NAND (SLC) | FLASH | SPI - Quad I/O | 7 ns | 16-SOIC | 7.5 mm | 0.295 " |
Winbond Electronics | 8-WSON (8x6) | 700 µs | 2 Gbit | -40 °C | 105 °C | 3.6 V | 2.7 V | 104 MHz | 256 M | Surface Mount | Non-Volatile | FLASH - NAND (SLC) | FLASH | SPI - Quad I/O | 7 ns | 8-WDFN Exposed Pad | ||
Winbond Electronics | 16-SOIC | 700 µs | 2 Gbit | -40 °C | 105 °C | 3.6 V | 2.7 V | 104 MHz | 256 M | Surface Mount | Non-Volatile | FLASH - NAND (SLC) | FLASH | SPI - Quad I/O | 7 ns | 16-SOIC | 7.5 mm | 0.295 " |
Winbond Electronics | 24-TFBGA (8x6) | 700 µs | 2 Gbit | -40 ¯C | 85 C | 3.6 V | 2.7 V | 104 MHz | 256 M | Surface Mount | Non-Volatile | FLASH - NAND (SLC) | FLASH | SPI | 24-TBGA | |||
Winbond Electronics | 8-WSON (8x6) | 700 µs | 2 Gbit | -40 ¯C | 85 C | 3.6 V | 2.7 V | 104 MHz | 256 M | Surface Mount | Non-Volatile | FLASH - NAND (SLC) | FLASH | SPI - Quad I/O | 7 ns | 8-WDFN Exposed Pad | ||
Winbond Electronics | 16-SOIC | 700 µs | 2 Gbit | -40 ¯C | 85 C | 3.6 V | 2.7 V | 104 MHz | 256 M | Surface Mount | Non-Volatile | FLASH - NAND (SLC) | FLASH | SPI - Quad I/O | 7 ns | 16-SOIC | 7.5 mm | 0.295 " |
Winbond Electronics | 24-TFBGA (8x6) | 700 µs | 2 Gbit | -40 ¯C | 85 C | 3.6 V | 2.7 V | 104 MHz | 256 M | Surface Mount | Non-Volatile | FLASH - NAND (SLC) | FLASH | SPI | 24-TBGA | |||
Winbond Electronics | 24-TFBGA (8x6) | 700 µs | 2 Gbit | -40 °C | 105 °C | 3.6 V | 2.7 V | 104 MHz | 256 M | Surface Mount | Non-Volatile | FLASH - NAND (SLC) | FLASH | SPI - Quad I/O | 7 ns | 24-TBGA | ||
Winbond Electronics | 24-TFBGA (8x6) | 700 µs | 2 Gbit | -40 °C | 105 °C | 3.6 V | 2.7 V | 104 MHz | 256 M | Surface Mount | Non-Volatile | FLASH - NAND (SLC) | FLASH | SPI - Quad I/O | 7 ns | 24-TBGA | ||
Winbond Electronics | 24-TFBGA (8x6) | 700 µs | 2 Gbit | -40 ¯C | 85 C | 3.6 V | 2.7 V | 104 MHz | 256 M | Surface Mount | Non-Volatile | FLASH - NAND (SLC) | FLASH | SPI - Quad I/O | 7 ns | 24-TBGA |