Zenode.ai Logo
Beta
256 FBGA
Integrated Circuits (ICs)

M2S010TS-1VFG256I

Active
Microchip Technology

LOW DENSITY DEVICES WITH HARD ARM CORTEX-M3

Deep-Dive with AI

Search across all available documentation for this part.

DocumentsDatasheet
256 FBGA
Integrated Circuits (ICs)

M2S010TS-1VFG256I

Active
Microchip Technology

LOW DENSITY DEVICES WITH HARD ARM CORTEX-M3

Deep-Dive with AI

DocumentsDatasheet

Technical Specifications

Parameters and characteristics for this part

SpecificationM2S010TS-1VFG256I
ArchitectureMCU, FPGA
ConnectivityCANbus, USB, Ethernet, SPI, UART/USART, I2C
Core ProcessorARM® Cortex®-M3
Flash Size256 KB
Number of I/O138
Operating Temperature [Max]100 °C
Operating Temperature [Min]-40 C
Package / Case256-LBGA
PeripheralsDDR, PCIe, SERDES
Primary AttributesFPGA - 10K Logic Modules
RAM Size64 KB
Speed166 MHz
Supplier Device Package256-FPBGA (17x17)

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyTray 1$ 60.08
100$ 59.22
Microchip DirectTRAY 1$ 60.08
50$ 59.22
250$ 57.54
500$ 55.97
1000$ 31.43
5000$ 28.57

Description

General part information

M2S010TS Series

These flash FPGA devices are ideal for general purpose functions such as Gigabit Ethernet or dual PCI Express control planes, bridging functions, input/output (I/O) expansion and conversion, video/image processing, system management and secure connectivity. Microchip FPGAs are used by customers in Communications, Industrial, Medical, Defense, and Aviation markets.

More Resources in Low Density Devices

• ARM Cortex-M3 Processor with embedded flash

Documents

Technical documentation and resources