Specification	FDME1023PZT

Configuration	2 P-Channel
Current - Continuous Drain (Id) @ 25°C	2.6 A
Drain to Source Voltage (Vdss)	20 V
FET Feature	Logic Level Gate
Gate Charge (Qg) (Max) @ Vgs	7.7 nC
Input Capacitance (Ciss) (Max) @ Vds	405 pF
Mounting Type	Surface Mount
Operating Temperature [Max]	150 °C
Operating Temperature [Min]	-55 °C
Package / Case	6-UFDFN Exposed Pad
Power - Max [Max]	600 mW
Rds On (Max) @ Id, Vgs	142 mOhm
Supplier Device Package	6-MicroFET
Supplier Device Package [x]	1.6
Supplier Device Package [y]	1.6
Technology	MOSFET (Metal Oxide)
Vgs(th) (Max) @ Id	1 V

FDME1023PZT Series

Dual P-Channel PowerTrench® MOSFET -20V, -2.6A, 142mΩ

Part	Mounting Type	Supplier Device Package [y]	Supplier Device Package [x]	Supplier Device Package	Power - Max [Max]	Technology	Current - Continuous Drain (Id) @ 25°C	Package / Case	Input Capacitance (Ciss) (Max) @ Vds	Configuration	Operating Temperature [Min]	Operating Temperature [Max]	Vgs(th) (Max) @ Id	Gate Charge (Qg) (Max) @ Vgs	FET Feature	Drain to Source Voltage (Vdss)	Rds On (Max) @ Id, Vgs
ON Semiconductor FDME1023PZT	Surface Mount	1.6	1.6	6-MicroFET	600 mW	MOSFET (Metal Oxide)	2.6 A	6-UFDFN Exposed Pad	405 pF	2 P-Channel	-55 °C	150 °C	1 V	7.7 nC	Logic Level Gate	20 V	142 mOhm

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$

Digikey	Cut Tape (CT)	1	$ 1.41
		10	$ 0.89
		100	$ 0.59
		500	$ 0.46
		1000	$ 0.42
		2000	$ 0.38
	Digi-Reel®	1	$ 1.41
		10	$ 0.89
		100	$ 0.59
		500	$ 0.46
		1000	$ 0.42
		2000	$ 0.38
	Tape & Reel (TR)	5000	$ 0.34
		10000	$ 0.32
		25000	$ 0.32
Newark	Each (Supplied on Full Reel)	3000	$ 0.43
		6000	$ 0.40
		12000	$ 0.37
		18000	$ 0.34
		30000	$ 0.33

Description

General part information

FDME1023PZT Series

This device is designed specifically as a single package solution for the battery charges switch in cellular handset and other ultra-portable applications. It features two independent P-Channel MOSFETs with low on-state resistance for minimum conduction losses. When connected in the typical common source configuration, bi-directional current flow is possible.The MicroFET 1.6x1.6 Thin package offers exceptional thermal performance for it's physical size and is well suited to switching and linear mode applications.

Documents

Technical documentation and resources

Technical Data Sheet EN

Datasheet

Package Drawing-517DW-UDFN6 1.6x1.6, 0.5P

Package Drawing