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Integrated Circuits (ICs)

TLC2201CDR

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Texas Instruments

LOW NOISE PRECISION RAIL-TO-RAIL OUTPUT OPERATIONAL AMPLIFIER

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SOIC (D)
Integrated Circuits (ICs)

TLC2201CDR

Active
Texas Instruments

LOW NOISE PRECISION RAIL-TO-RAIL OUTPUT OPERATIONAL AMPLIFIER

Technical Specifications

Parameters and characteristics for this part

SpecificationTLC2201CDR
Amplifier TypeGeneral Purpose
Current - Input Bias1 pA
Current - Output / Channel50 mA
Current - Supply1.1 mA
Mounting TypeSurface Mount
Number of Circuits1
Operating Temperature [Max]70 °C
Operating Temperature [Min]0 °C
Output TypeRail-to-Rail
Package / Case8-SOIC
Package / Case [x]0.154 in
Package / Case [y]3.9 mm
Slew Rate2.7 V/µs
Supplier Device Package8-SOIC
Voltage - Input Offset100 çV
Voltage - Supply Span (Max) [Max]16 V
Voltage - Supply Span (Min) [Min]4.6 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyTape & Reel (TR) 2500$ 2.40
Texas InstrumentsLARGE T&R 1$ 3.79
100$ 3.09
250$ 2.42
1000$ 2.06

Description

General part information

TLC2201AM Series

The TLC220x, TLC220xA, TLC220xB, and TLC220xY are precision, low-noise operational amplifiers using Texas Instruments Advanced LinCMOS™ process. These devices combine the noise performance of the lowest-noise JFET amplifiers with the dc precision available previously only in bipolar amplifiers. The Advanced LinCMOS™ process uses silicon-gate technology to obtain input offset voltage stability with temperature and time that far exceeds that obtainable using metal-gate technology. In addition, this technology makes possible input impedance levels that meet or exceed levels offered by top-gate JFET and expensive dielectric-isolated devices.

The combination of excellent DC and noise performance with a common-mode input voltage range that includes the negative rail makes these devices an ideal choice for high-impedance, low-level signal-conditioning applications in either single-supply or split-supply configurations.

The device inputs and outputs are designed to withstand –100-mA surge currents without sustaining latch-up. In addition, internal ESD-protection circuits prevent functional failures at voltages up to 2000 V as tested under MIL-PRF-38535, Method 3015.2; however, care should be exercised in handling these devices as exposure to ESD may result in degradation of the parametric performance.