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RQ6E040XNTCR
Discrete Semiconductor Products

RQ6E040XNTCR

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Rohm Semiconductor

NCH 30V 4A SMALL SIGNAL MOSFET

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RQ6E040XNTCR
Discrete Semiconductor Products

RQ6E040XNTCR

Active
Rohm Semiconductor

NCH 30V 4A SMALL SIGNAL MOSFET

Technical Specifications

Parameters and characteristics for this part

SpecificationRQ6E040XNTCR
Current - Continuous Drain (Id) @ 25°C4 A
Drain to Source Voltage (Vdss)30 V
Drive Voltage (Max Rds On, Min Rds On) [Max]4 V
Drive Voltage (Max Rds On, Min Rds On) [Min]10 V
FET TypeN-Channel
Gate Charge (Qg) (Max) @ Vgs3.3 nC
Input Capacitance (Ciss) (Max) @ Vds [Max]180 pF
Mounting TypeSurface Mount
Operating Temperature150 °C
Package / CaseSOT-23-6 Thin, TSOT-23-6
Power Dissipation (Max)950 mW
Rds On (Max) @ Id, Vgs50 mOhm
Supplier Device PackageTSMT6 (SC-95)
TechnologyMOSFET (Metal Oxide)
Vgs (Max)20 V
Vgs(th) (Max) @ Id2.5 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyN/A 2759$ 0.74

Description

General part information

RQ6E040XN Series

RQ6E040XN is the low on-resistance MOSFET, built-in G-S protection diode for switching application.

Documents

Technical documentation and resources

Compliance of the RoHS directive

Environmental Data

About Flammability of Materials

Environmental Data

List of Transistor Package Thermal Resistance

Thermal Design

Anti-Whisker formation - Transistors

Package Information

Notes for Calculating Power Consumption:Static Operation

Thermal Design

Measurement Method and Usage of Thermal Resistance RthJC

Thermal Design

Calculation of Power Dissipation in Switching Circuit

Schematic Design & Verification

Method for Monitoring Switching Waveform

Schematic Design & Verification

PCB Layout Thermal Design Guide

Thermal Design

Impedance Characteristics of Bypass Capacitor

Schematic Design & Verification

Condition of Soldering / Land Pattern Reference

Package Information

Part Explanation

Application Note

Reliability Test Result

Manufacturing Data

Basics of Thermal Resistance and Heat Dissipation

Thermal Design

How to Use LTspice® Models: Tips for Improving Convergence

Schematic Design & Verification

Two-Resistor Model for Thermal Simulation

Thermal Design

Method for Calculating Junction Temperature from Transient Thermal Resistance Data

Thermal Design

How to Create Symbols for PSpice Models

Models

Importance of Probe Calibration When Measuring Power: Deskew

Schematic Design & Verification

Notes for Temperature Measurement Using Thermocouples

Thermal Design

Notes for Temperature Measurement Using Forward Voltage of PN Junction

Thermal Design

MOSFET Gate Resistor Setting for Motor Driving

Technical Article

Explanation for Marking

Package Information

TSMT6_TCR Taping Information

Package Information

What is a Thermal Model? (Transistor)

Thermal Design

Certificate of not containing SVHC under REACH Regulation

Environmental Data

Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)

Technical Article

About Export Regulations

Export Information

Inner Structure

Package Information

RQ6E040XN ESD Data

Characteristics Data

What Is Thermal Design

Thermal Design

Precautions When Measuring the Rear of the Package with a Thermocouple

Thermal Design

RQ6E040XN Data Sheet

Data Sheet

How to Use LTspice® Models

Schematic Design & Verification

Package Dimensions

Package Information

Types and Features of Transistors

Application Note

Moisture Sensitivity Level - Transistors

Package Information

MOSFET Gate Drive Current Setting for Motor Driving

Technical Article

Temperature derating method for Safe Operating Area (SOA)

Schematic Design & Verification