Connectors, Interconnects

SIP050-1X11-160B

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Amphenol ICC (FCI)

1X11-160B-SIP SOCKET 11 CTS

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Connectors, Interconnects

SIP050-1X11-160B

Active

Amphenol ICC (FCI)

1X11-160B-SIP SOCKET 11 CTS

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Specifications Series Pricing Description Documents

Technical Specifications

Parameters and characteristics for this part

Specification	SIP050-1X11-160B

Contact Finish - Mating	Gold
Contact Finish - Post	Tin
Contact Finish Thickness - Mating	0.76 Ám
Contact Finish Thickness - Mating	30 Áin
Contact Finish Thickness - Post	200 µin
Contact Finish Thickness - Post	5.08 µm
Contact Material - Mating	Beryllium Copper
Contact Material - Post [custom]	Brass
Features	Closed Frame
Housing Material	Polyester, Glass Filled, Polycyclohexylenedimethylene Terephthalate (PCT)
Material Flammability Rating	UL94 V-0
Mounting Type	Through Hole
Number of Positions or Pins (Grid)	11
Number of Positions or Pins (Grid) [custom]	1
Number of Positions or Pins (Grid) [custom]	11
Pitch - Mating	0.1 "
Pitch - Mating	2.54 mm
Pitch - Post	0.1 in
Pitch - Post	2.54 mm
Termination	Solder
Termination Post Length	0.095 "
Termination Post Length	2.41 mm
Type	SIP

SIP050 Series

...

Part	Termination Post Length	Termination Post Length	Material Flammability Rating	Features	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Contact Material - Mating	Pitch - Post	Pitch - Post	Mounting Type	Contact Finish - Post	Pitch - Mating	Pitch - Mating	Termination	Housing Material	Number of Positions or Pins (Grid)	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Type	Contact Material - Post [custom]	Number of Positions or Pins (Grid) [custom]	Number of Positions or Pins (Grid) [custom]	Number of Positions or Pins (Grid) [y]	Number of Positions or Pins (Grid) [x]	Contact Finish - Mating	Number of Positions or Pins (Grid) [custom]	Number of Positions or Pins (Grid) [custom]
Amphenol ICC (FCI) SIP050-1X09-157B	0.095 "	2.41 mm	UL94 V-0	Closed Frame	200 µin	5.08 µm	Beryllium Copper	0.1 in	2.54 mm	Through Hole	Tin	0.1 "	2.54 mm	Solder	Glass Filled Polycyclohexylenedimethylene Terephthalate (PCT) Polyester	9	5.08 µm	200 µin	SIP	Brass
Amphenol ICC (FCI) SIP050-1X32-157B	0.095 "	2.41 mm	UL94 V-0	Closed Frame	200 µin	5.08 µm	Beryllium Copper	0.1 in	2.54 mm	Through Hole	Tin	0.1 "	2.54 mm	Solder	Glass Filled Polycyclohexylenedimethylene Terephthalate (PCT) Polyester	32	5.08 µm	200 µin	SIP	Brass	1 x 32
Amphenol ICC (FCI) SIP050-1X18-157B	0.095 "	2.41 mm	UL94 V-0	Closed Frame	200 µin	5.08 µm	Beryllium Copper	0.1 in	2.54 mm	Through Hole	Tin	0.1 "	2.54 mm	Solder	Glass Filled Polycyclohexylenedimethylene Terephthalate (PCT) Polyester		5.08 µm	200 µin	SIP	Brass		18	18	1
Amphenol ICC (FCI) SIP050-1X10-160B	0.095 "	2.41 mm	UL94 V-0	Closed Frame	200 µin	5.08 µm	Beryllium Copper	0.1 in	2.54 mm	Through Hole	Tin	0.1 "	2.54 mm	Solder	Glass Filled Polycyclohexylenedimethylene Terephthalate (PCT) Polyester	10	0.76 Ám	30 Áin	SIP	Brass			10	1	Gold
Amphenol ICC (FCI) SIP050-1X32-160BLF	0.095 "	2.41 mm	UL94 V-0	Closed Frame	200 µin	5.08 µm	Beryllium Copper	0.1 in	2.54 mm	Through Hole	Tin	0.1 "	2.54 mm	Solder	Glass Filled Polycyclohexylenedimethylene Terephthalate (PCT) Polyester	32	0.76 Ám	30 Áin	SIP	Brass	1 x 32				Gold
Amphenol ICC (FCI) SIP050-1X31-160BLF	0.095 "	2.41 mm	UL94 V-0	Closed Frame	200 µin	5.08 µm	Beryllium Copper	0.1 in	2.54 mm	Through Hole	Tin	0.1 "	2.54 mm	Solder	Glass Filled Polycyclohexylenedimethylene Terephthalate (PCT) Polyester	31	0.76 Ám	30 Áin	SIP	Brass					Gold
Amphenol ICC (FCI) SIP050-1X11-160B	0.095 "	2.41 mm	UL94 V-0	Closed Frame	200 µin	5.08 µm	Beryllium Copper	0.1 in	2.54 mm	Through Hole	Tin	0.1 "	2.54 mm	Solder	Glass Filled Polycyclohexylenedimethylene Terephthalate (PCT) Polyester	11	0.76 Ám	30 Áin	SIP	Brass					Gold	1	11
Amphenol ICC (FCI) SIP050-1X12-157BLF	0.095 "	2.41 mm	UL94 V-0	Closed Frame	200 µin	5.08 µm	Beryllium Copper	0.1 in	2.54 mm	Through Hole	Tin	0.1 "	2.54 mm	Solder	Glass Filled Polycyclohexylenedimethylene Terephthalate (PCT) Polyester		5.08 µm	200 µin	SIP	Brass		12	12	1
Amphenol ICC (FCI) SIP050-1X28-157BLF	0.095 "	2.41 mm	UL94 V-0	Closed Frame	200 µin	5.08 µm	Beryllium Copper	0.1 in	2.54 mm	Through Hole	Tin	0.1 "	2.54 mm	Solder	Glass Filled Polycyclohexylenedimethylene Terephthalate (PCT) Polyester	28	5.08 µm	200 µin	SIP	Brass			28	1
Amphenol ICC (FCI) SIP050-1X26-157BLF	0.095 "	2.41 mm	UL94 V-0	Closed Frame	200 µin	5.08 µm	Beryllium Copper	0.1 in	2.54 mm	Through Hole	Tin	0.1 "	2.54 mm	Solder	Glass Filled Polycyclohexylenedimethylene Terephthalate (PCT) Polyester	26	5.08 µm	200 µin	SIP	Brass						1	26

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$

Digikey	N/A	0	$ 0.00

Description

General part information

SIP050 Series

11 (1 x 11) Pos SIP Socket Gold Through Hole

Documents

Technical documentation and resources

No documents available