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Technical Specifications
Parameters and characteristics for this part
| Specification | SIP050-1X31-160BLF |
|---|---|
| Contact Finish - Mating | Gold |
| Contact Finish - Post | Tin |
| Contact Finish Thickness - Mating | 0.76 Ám |
| Contact Finish Thickness - Mating | 30 Áin |
| Contact Finish Thickness - Post | 200 µin |
| Contact Finish Thickness - Post | 5.08 µm |
| Contact Material - Mating | Beryllium Copper |
| Contact Material - Post [custom] | Brass |
| Features | Closed Frame |
| Housing Material | Polyester, Glass Filled, Polycyclohexylenedimethylene Terephthalate (PCT) |
| Material Flammability Rating | UL94 V-0 |
| Mounting Type | Through Hole |
| Number of Positions or Pins (Grid) | 31 |
| Pitch - Mating | 0.1 " |
| Pitch - Mating | 2.54 mm |
| Pitch - Post | 0.1 in |
| Pitch - Post | 2.54 mm |
| Termination | Solder |
| Termination Post Length | 0.095 " |
| Termination Post Length | 2.41 mm |
| Type | SIP |
...
| Part | Termination Post Length | Termination Post Length | Material Flammability Rating | Features | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Contact Material - Mating | Pitch - Post | Pitch - Post | Mounting Type | Contact Finish - Post | Pitch - Mating | Pitch - Mating | Termination | Housing Material | Number of Positions or Pins (Grid) | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Type | Contact Material - Post [custom] | Number of Positions or Pins (Grid) [custom] | Number of Positions or Pins (Grid) [custom] | Number of Positions or Pins (Grid) [y] | Number of Positions or Pins (Grid) [x] | Contact Finish - Mating | Number of Positions or Pins (Grid) [custom] | Number of Positions or Pins (Grid) [custom] |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Amphenol ICC (FCI) | 0.095 " | 2.41 mm | UL94 V-0 | Closed Frame | 200 µin | 5.08 µm | Beryllium Copper | 0.1 in | 2.54 mm | Through Hole | Tin | 0.1 " | 2.54 mm | Solder | Glass Filled Polycyclohexylenedimethylene Terephthalate (PCT) Polyester | 9 | 5.08 µm | 200 µin | SIP | Brass | |||||||
Amphenol ICC (FCI) | 0.095 " | 2.41 mm | UL94 V-0 | Closed Frame | 200 µin | 5.08 µm | Beryllium Copper | 0.1 in | 2.54 mm | Through Hole | Tin | 0.1 " | 2.54 mm | Solder | Glass Filled Polycyclohexylenedimethylene Terephthalate (PCT) Polyester | 32 | 5.08 µm | 200 µin | SIP | Brass | 1 x 32 | ||||||
Amphenol ICC (FCI) | 0.095 " | 2.41 mm | UL94 V-0 | Closed Frame | 200 µin | 5.08 µm | Beryllium Copper | 0.1 in | 2.54 mm | Through Hole | Tin | 0.1 " | 2.54 mm | Solder | Glass Filled Polycyclohexylenedimethylene Terephthalate (PCT) Polyester | 5.08 µm | 200 µin | SIP | Brass | 18 | 18 | 1 | |||||
Amphenol ICC (FCI) | 0.095 " | 2.41 mm | UL94 V-0 | Closed Frame | 200 µin | 5.08 µm | Beryllium Copper | 0.1 in | 2.54 mm | Through Hole | Tin | 0.1 " | 2.54 mm | Solder | Glass Filled Polycyclohexylenedimethylene Terephthalate (PCT) Polyester | 10 | 0.76 Ám | 30 Áin | SIP | Brass | 10 | 1 | Gold | ||||
Amphenol ICC (FCI) | 0.095 " | 2.41 mm | UL94 V-0 | Closed Frame | 200 µin | 5.08 µm | Beryllium Copper | 0.1 in | 2.54 mm | Through Hole | Tin | 0.1 " | 2.54 mm | Solder | Glass Filled Polycyclohexylenedimethylene Terephthalate (PCT) Polyester | 32 | 0.76 Ám | 30 Áin | SIP | Brass | 1 x 32 | Gold | |||||
Amphenol ICC (FCI) | 0.095 " | 2.41 mm | UL94 V-0 | Closed Frame | 200 µin | 5.08 µm | Beryllium Copper | 0.1 in | 2.54 mm | Through Hole | Tin | 0.1 " | 2.54 mm | Solder | Glass Filled Polycyclohexylenedimethylene Terephthalate (PCT) Polyester | 31 | 0.76 Ám | 30 Áin | SIP | Brass | Gold | ||||||
Amphenol ICC (FCI) | 0.095 " | 2.41 mm | UL94 V-0 | Closed Frame | 200 µin | 5.08 µm | Beryllium Copper | 0.1 in | 2.54 mm | Through Hole | Tin | 0.1 " | 2.54 mm | Solder | Glass Filled Polycyclohexylenedimethylene Terephthalate (PCT) Polyester | 11 | 0.76 Ám | 30 Áin | SIP | Brass | Gold | 1 | 11 | ||||
Amphenol ICC (FCI) | 0.095 " | 2.41 mm | UL94 V-0 | Closed Frame | 200 µin | 5.08 µm | Beryllium Copper | 0.1 in | 2.54 mm | Through Hole | Tin | 0.1 " | 2.54 mm | Solder | Glass Filled Polycyclohexylenedimethylene Terephthalate (PCT) Polyester | 5.08 µm | 200 µin | SIP | Brass | 12 | 12 | 1 | |||||
Amphenol ICC (FCI) | 0.095 " | 2.41 mm | UL94 V-0 | Closed Frame | 200 µin | 5.08 µm | Beryllium Copper | 0.1 in | 2.54 mm | Through Hole | Tin | 0.1 " | 2.54 mm | Solder | Glass Filled Polycyclohexylenedimethylene Terephthalate (PCT) Polyester | 28 | 5.08 µm | 200 µin | SIP | Brass | 28 | 1 | |||||
Amphenol ICC (FCI) | 0.095 " | 2.41 mm | UL94 V-0 | Closed Frame | 200 µin | 5.08 µm | Beryllium Copper | 0.1 in | 2.54 mm | Through Hole | Tin | 0.1 " | 2.54 mm | Solder | Glass Filled Polycyclohexylenedimethylene Terephthalate (PCT) Polyester | 26 | 5.08 µm | 200 µin | SIP | Brass | 1 | 26 |
Pricing
Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly
| Distributor | Package | Quantity | $ | |
|---|---|---|---|---|
| Digikey | N/A | 0 | $ 0.00 | |
Description
General part information
SIP050 Series
31 (1 x 31) Pos SIP Socket Gold Through Hole
Documents
Technical documentation and resources
No documents available