Integrated Circuits (ICs)

A54SX32-PQG208

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FPGA SX FAMILY 32K GATES 1800 CELLS 240MHZ 0.35UM (CMOS) TECHNOLOGY 3.3V/5V 208-PIN PQFP

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Integrated Circuits (ICs)

Active

FPGA SX FAMILY 32K GATES 1800 CELLS 240MHZ 0.35UM (CMOS) TECHNOLOGY 3.3V/5V 208-PIN PQFP

Technical Specifications

Parameters and characteristics for this part

Very Low power Antifuse FPGA

Part	Package / Case	Operating Temperature [Max]	Operating Temperature [Min]	Number of Gates [custom]	Supplier Device Package	Number of I/O	Number of LABs/CLBs	Voltage - Supply [Min]	Voltage - Supply [Max]	Mounting Type
Microchip Technology A54SX32A-FBG329	329-BBGA	70 °C	0 °C	48000	329-PBGA (31x31)	249	2880 LABs/CLBs	2.25 V	5.25 V	Surface Mount
Microchip Technology A54SX32-2PQG208	208-BFQFP	70 °C	0 °C	48000	208-PQFP (28x28)	174	2880 LABs/CLBs	3 V 4.75 V	3.6 V 5.25 V	Surface Mount
Microchip Technology A54SX32A-BGG329I	329-BBGA	85 °C	-40 °C	48000	329-PBGA (31x31)	249	2880 LABs/CLBs	2.25 V	5.25 V	Surface Mount
Microchip Technology A54SX32A-1BGG329	329-BBGA	70 °C	0 °C	48000	329-PBGA (31x31)	249	2880 LABs/CLBs	2.25 V	5.25 V	Surface Mount
Microchip Technology A54SX32A-1CQ256B	256-BFCQFP with Tie Bar	125 ¯C	-55 °C	48000	256-CQFP (75x75)	203	2880 LABs/CLBs	2.25 V	5.25 V	Surface Mount
Microchip Technology A54SX32-TQG144I	144-LQFP	85 °C	-40 °C	48000	144-TQFP (20x20)	113 I/O	2880 LABs/CLBs	3 V 4.75 V	3.6 V 5.25 V	Surface Mount
Microchip Technology A54SX32-1CQ208B	208-BFCQFP with Tie Bar	125 ¯C	-55 °C	48000	208-CQFP (75x75)	174	2880 LABs/CLBs	3 V 4.75 V	3.6 V 5.25 V	Surface Mount
Microchip Technology A54SX32A-1FG256	256-BGA	70 °C	0 °C	48000	256-FPBGA (17x17)	203	2880 LABs/CLBs	2.25 V	5.25 V	Surface Mount
Microchip Technology A54SX32A-TQG144A	144-LQFP	125 °C	-40 °C	48000	144-TQFP (20x20)	113 I/O	2880 LABs/CLBs	2.25 V	5.25 V	Surface Mount
Microchip Technology A54SX32-PQG208	208-BFQFP	70 °C	0 °C	48000	208-PQFP (28x28)	174	2880 LABs/CLBs	3 V 4.75 V	3.6 V 5.25 V	Surface Mount

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General part information

The SX family of FPGAs features a

sea-of-modules architecture that greatly simplify design time, enable

dramatic reductions in design costs and power consumption, and further

Technical documentation and resources