Specification	BD7F200EFJ-LBE2

Current - Output	2.2 A
Frequency - Switching	400 kHz
Function	Step-Up/Step-Down
Mounting Type	Surface Mount
Number of Outputs	1
Operating Temperature [Max]	125 °C
Operating Temperature [Min]	-40 C
Output Configuration	Isolation Capable, Positive
Output Type	Adjustable
Package / Case	Exposed Pad, 8-SOIC
Package / Case [x]	0.154 in
Package / Case [y]	3.9 mm
Supplier Device Package	8-HTSOP-J
Synchronous Rectifier	False
Topology	Flyback
Voltage - Input (Min) [Min]	8 V
Voltage - Output (Max) [Max]	50 V
Voltage - Output (Min/Fixed) [Min]	0.78 V

BD7F200 Series

Optocoupler-less Isolated Flyback Converter

Part	Supplied Contents	Board Type	Outputs and Type	Outputs and Type	Regulator Topology	Current - Output	Voltage - Input	Utilized IC / Part	Main Purpose	Contents	Voltage - Output	Frequency - Switching	Mounting Type	Supplier Device Package	Output Configuration	Package / Case	Voltage - Input (Min) [Min]	Output Type	Function	Topology	Operating Temperature [Min]	Operating Temperature [Max]	Voltage - Output (Max) [Max]	Voltage - Output (Min/Fixed) [Min]	Number of Outputs	Package / Case [y]	Package / Case [x]
Rohm Semiconductor BD7F200HFN-EVK-002	Board(s)	Fully Populated	1 Isolated Output Isolated	1	Flyback	2 A	24 VDC	BD7F200	DC/DC Step Down	Board(s)	5 V	400 kHz
Rohm Semiconductor BD7F200EFJ-EVK-001	Board(s)	Fully Populated	4 Isolated Outputs Isolated	4	Flyback	150 mA	24 VDC	BD7F200	DC/DC Step Down	Board(s)	15 V	400 kHz
Rohm Semiconductor BD7F200HFN-LBTR						2.2 A						400 kHz	Surface Mount	8-HSON	Isolation Capable Positive	8-PowerUDFN	8 V	Adjustable	Step-Up/Step-Down	Flyback	-40 C	125 °C	50 V	0.78 V	1
Rohm Semiconductor BD7F200HFN-EVK-001	Board(s)	Fully Populated	4 Isolated Outputs Isolated	4	Flyback	150 mA	24 VDC	BD7F200	DC/DC Step Down	Board(s)	15 V	400 kHz
Rohm Semiconductor BD7F200EFJ-LBE2						2.2 A						400 kHz	Surface Mount	8-HTSOP-J	Isolation Capable Positive	8-SOIC Exposed Pad	8 V	Adjustable	Step-Up/Step-Down	Flyback	-40 C	125 °C	50 V	0.78 V	1	3.9 mm	0.154 in
Rohm Semiconductor BD7F200EFJ-EVK-002	Board(s)	Fully Populated	1 Isolated Output Isolated	1	Flyback	2 A	24 VDC	BD7F200	DC/DC Step Down	Board(s)	5 V	400 kHz

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$

Digikey	Cut Tape (CT)	1	$ 11.43
		10	$ 8.29
		100	$ 6.85
		500	$ 6.00
		1000	$ 5.67
	Digi-Reel®	1	$ 11.43
		10	$ 8.29
		100	$ 6.85
		500	$ 6.00
		1000	$ 5.67
	N/A	2254	$ 10.70
	Tape & Reel (TR)	2500	$ 5.54
Newark	Each (Supplied on Cut Tape)	1	$ 11.13
		10	$ 8.57
		25	$ 8.07
		50	$ 7.58
		100	$ 7.08
		250	$ 6.20
		500	$ 5.72
		1000	$ 5.22

Description

General part information

BD7F200 Series

This product guarantees long time supply availability in the industrial instrumentation market.BD7F200 is an optocoupler-less Isolated Flyback Converter. An optocoupler or the tertiary winding feedback circuit which was needed to obtain a stable output voltage isolated by a transformer in the conventional application becomes unnecessary, thus, the number of parts is reduced drastically, producing a small-sized and high-reliability application isolated type power supply. Furthermore, a highly by the use of the Original Adapted-Type ON-Time Control Technology, it makes the external phase compensation parts become unnecessary, therefore a highly efficient isolated type power supply application can easily be produced.

Documents

Technical documentation and resources

Method for Calculating Junction Temperature from Transient Thermal Resistance Data

Thermal Design

HTSOP-J8 Package Information

Package Information

BD7F200EFJ-LB Data Sheet

Data Sheet

Technical Data Sheet EN

Datasheet

Product Change Notice EN

Datasheet

BD7F200EFJ-LBE2

Deep-Dive with AI

BD7F200EFJ-LBE2

Deep-Dive with AI

Technical Specifications

BD7F200 Series

Pricing

Description

BD7F200 Series

Documents

PCB Layout Thermal Design Guide

Compliance with the ELV directive

Solder Joint Rate and Thermal Resistance of Exposed Pad

What Is Thermal Design

Thermal Resistance

θ<sub>JC</sub> and Ψ<sub>JT</sub>

Evaluation Board User's Guide for BD7F200EFJ-EVK-001 user's guide

Basics of Thermal Resistance and Heat Dissipation

Heat Dissipation Effect of Thermal Via in Exposed Pad Type Package

Design Guide and Example of Stencil for Exposed Pad

Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)

How to Use the Two-Resistor Model

Anti-Whisker formation

Factory Information

θ<sub>JA</sub> and Ψ<sub>JT</sub>

Evaluation Board User's Guide for BD7F200EFJ-EVK-002 user's guide

Judgment Criteria of Thermal Evaluation

UL94 Flame Classifications of Mold Compound

How to Use the Thermal Resistance and Thermal Characteristics Parameters

Impedance Characteristics of Bypass Capacitor

BD7Fx00xxx-LB Series Reference Circuit

Five Steps for Successful Thermal Design of IC

Method for Calculating Junction Temperature from Transient Thermal Resistance Data

HTSOP-J8 Package Information

BD7F200EFJ-LB Data Sheet

Technical Data Sheet EN

Product Change Notice EN

BD7F200 Series