TFP401APZPR
Active165-MHZ TMDS DVI RECEIVER/DESERIALIZER WITH HSYNC & PANELBUS™ INTEGRATED CIRCUIT
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TFP401APZPR
Active165-MHZ TMDS DVI RECEIVER/DESERIALIZER WITH HSYNC & PANELBUS™ INTEGRATED CIRCUIT
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Technical Specifications
Parameters and characteristics for this part
| Specification | TFP401APZPR |
|---|---|
| Mounting Type | Surface Mount |
| Number of Drivers/Receivers [custom] | 3 |
| Number of Drivers/Receivers [custom] | 0 |
| Operating Temperature [Max] | 70 °C |
| Operating Temperature [Min] | 0 °C |
| Package / Case | 100-TQFP Exposed Pad |
| Protocol | PanelBus™ |
| Supplier Device Package | 100-HTQFP (14x14) |
| Type | Receiver |
| Voltage - Supply [Max] | 3.6 V |
| Voltage - Supply [Min] | 3 V |
Pricing
Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly
| Distributor | Package | Quantity | $ | |
|---|---|---|---|---|
| Digikey | Cut Tape (CT) | 1 | $ 8.17 | |
| 10 | $ 7.38 | |||
| 25 | $ 7.04 | |||
| 100 | $ 6.11 | |||
| 250 | $ 5.84 | |||
| 500 | $ 5.32 | |||
| Digi-Reel® | 1 | $ 8.17 | ||
| 10 | $ 7.38 | |||
| 25 | $ 7.04 | |||
| 100 | $ 6.11 | |||
| 250 | $ 5.84 | |||
| 500 | $ 5.32 | |||
| Tape & Reel (TR) | 1000 | $ 4.64 | ||
| 2000 | $ 4.46 | |||
| Texas Instruments | LARGE T&R | 1 | $ 6.26 | |
| 100 | $ 5.10 | |||
| 250 | $ 4.01 | |||
| 1000 | $ 3.40 | |||
Description
General part information
TFP401A-Q1 Series
The Texas Instruments TFP401 and TFP401A are TI PanelBus™ flat-panel display products, part of a comprehensive family of end-to-end DVI 1.0 compliant solutions. Targeted primarily at desktop LCD monitors and digital projectors, the TFP401/401A finds applications in any design requiring high-speed digital interface.
The TFP401 and TFP401A supports display resolutions up to 1080p and WUXGA in 24-bit true-color pixel format. The TFP401 and TFP401A offers design flexibility to drive one or two pixels per clock, supports TFT or DSTN panels, and provides an option for time-staggered pixel outputs for reduced ground bounce.
PowerPAD advanced packaging technology results in best-of-class power dissipation, footprint, and ultralow ground inductance.
Documents
Technical documentation and resources
