Specification	BM23FR0.6-20DS-0.35V(895)

Connector Type	Receptacle, Center Strip Contacts
Contact Finish	Gold
Contact Finish Thickness	1.97 Áin
Contact Finish Thickness	0.05 Ám
Features	Solder Retention
Height Above Board [z]	0.024 in
Height Above Board [z]	0.61 mm
Mated Stacking Heights	0.6 mm
Mounting Type	Surface Mount
Number of Positions	20
Number of Rows [custom]	2
Pitch	0.014 in
Pitch	0.35 mm

BM23FR Series

Part	Contact Finish	Number of Rows [custom]	Height Above Board [z]	Height Above Board [z]	Contact Finish Thickness	Contact Finish Thickness	Mounting Type	Number of Positions	Features	Mated Stacking Heights	Connector Type	Pitch	Pitch	Number of Positions [custom]
Hirose Electric Co Ltd BM23FR0.6-16DP-0.35V(895)	Gold	2	0.02 in	0.5 mm	1.97 Áin	0.05 Ám	Surface Mount	16	Solder Retention	0.6 mm	Header Outer Shroud Contacts	0.014 in	0.35 mm
Hirose Electric Co Ltd BM23FR0.6-34DS-0.35V(895)	Gold	2	0.024 in	0.61 mm	1.97 Áin	0.05 Ám	Surface Mount		Solder Retention	0.6 mm	Receptacle Center Strip Contacts	0.014 in	0.35 mm	34
Hirose Electric Co Ltd BM23FR0.6-20DS-0.35V(895)	Gold	2	0.024 in	0.61 mm	1.97 Áin	0.05 Ám	Surface Mount	20	Solder Retention	0.6 mm	Receptacle Center Strip Contacts	0.014 in	0.35 mm

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

General part information

BOARD TO BOARD & MEZZANINE CONNECTORS 20P RCPT STRGHT SMT SIGNAL ONLY

Technical documentation and resources