
Integrated Circuits (ICs)
RP605Z363B-E2-F
ActiveNisshinbo Micro Devices Inc.
300MA ULTRA-LOW POWER BUCK BOOST
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Integrated Circuits (ICs)
RP605Z363B-E2-F
ActiveNisshinbo Micro Devices Inc.
300MA ULTRA-LOW POWER BUCK BOOST
Deep-Dive with AI
DocumentsDatasheet
Technical Specifications
Parameters and characteristics for this part
| Specification | RP605Z363B-E2-F |
|---|---|
| Applications | Power Supplies, Battery Management |
| Current - Supply | 300 nA |
| Mounting Type | Surface Mount |
| Operating Temperature [Max] | 85 C |
| Operating Temperature [Min] | -40 ¯C |
| Package / Case | 20-XFBGA, WLCSP |
| Supplier Device Package | 20-WLCSP-P3 |
| Supplier Device Package [x] | 2.32 |
| Supplier Device Package [y] | 1.71 |
| Voltage - Supply [Max] | 5.5 V |
| Voltage - Supply [Min] | 1.8 V |
Pricing
Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly
Description
General part information
RP605 Series
Battery Management, Power Supplies PMIC 20-WLCSP-P3 (2.32x1.71)
Documents
Technical documentation and resources