Discrete Semiconductor Products

WB35SD160ALZ

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WB35SD160AL/NAU000/NO MARK*CHIPS

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Discrete Semiconductor Products

Active

WB35SD160AL/NAU000/NO MARK*CHIPS

Technical Specifications

Parameters and characteristics for this part

Specification	WB35SD160ALZ

Current - Average Rectified (Io)	35 A
Current - Reverse Leakage @ Vr	50 µA
Mounting Type	Surface Mount
Operating Temperature - Junction	150 ¯C
Package / Case	Die
Speed [Min]	200 mA, 500 ns
Supplier Device Package	Wafer
Technology	Standard

Part	Current - Reverse Leakage @ Vr	Package / Case	Technology	Speed [Min]	Mounting Type	Supplier Device Package	Operating Temperature - Junction	Current - Average Rectified (Io)
WeEn Semiconductors WB35SD160ALZ	50 µA	Die	Standard	200 mA 500 ns	Surface Mount	Wafer	150 ¯C	35 A

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General part information

Diode 1600 V 35A Surface Mount Wafer

Technical documentation and resources

No documents available