I3G4250DTR
Active3-AXIS GYROSCOPE FOR INDUSTRIAL APPLICATIONS, DIGITAL OUTPUT, EXTENDED OPERATING TEMPERATURE RANGE
I3G4250DTR
Active3-AXIS GYROSCOPE FOR INDUSTRIAL APPLICATIONS, DIGITAL OUTPUT, EXTENDED OPERATING TEMPERATURE RANGE
Technical Specifications
Parameters and characteristics for this part
| Specification | I3G4250DTR |
|---|---|
| Axis [x] | X |
| Axis [y] | Y |
| Axis [z] | Z |
| Current - Supply | 6.1 mA |
| Features | Adjustable Bandwidth, Selectable Scale, Temperature Sensor |
| Operating Temperature [Max] | 85 °C |
| Operating Temperature [Min] | -40 C |
| Output Type | SPI, I2C |
| Package / Case | 16-TFLGA |
| Range °/s | 2000 °/s, 500 °/s |
| Range °/s [Max] | 245 °/s |
| Range °/s [Min] | -245 °/s |
| Sensitivity (LSB/(°/s)) [Max] | 70 LSB/(°/s) |
| Sensitivity (LSB/(°/s)) [Min] | 8.75 LSB/(°/s) |
| Type | Digital |
| Voltage - Supply [Max] | 3.6 V |
| Voltage - Supply [Min] | 2.4 V |
Pricing
Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly
| Distributor | Package | Quantity | $ | |
|---|---|---|---|---|
| Digikey | Cut Tape (CT) | 1 | $ 11.09 | |
| 10 | $ 8.88 | |||
| 25 | $ 8.21 | |||
| 100 | $ 7.10 | |||
| 500 | $ 6.66 | |||
| 1000 | $ 6.21 | |||
| Digi-Reel® | 1 | $ 11.09 | ||
| 10 | $ 8.88 | |||
| 25 | $ 8.21 | |||
| 100 | $ 7.10 | |||
| 500 | $ 6.66 | |||
| 1000 | $ 6.21 | |||
| N/A | 8094 | $ 8.89 | ||
| Tape & Reel (TR) | 3000 | $ 6.10 | ||
Description
General part information
I3G4250 Series
The I3G4250D is a low-power 3-axis angular rate sensor able to provide unprecedented stability at zero-rate level and sensitivity over temperature and time. It includes a sensing element and an IC interface capable of providing the measured angular rate to the application through a standard SPI digital interface. An I²C compatible interface is also available.
The sensing element is manufactured using a dedicated micromachining process developed by STMicroelectronics to produce inertial sensors and actuators on silicon wafers.
The IC interface is manufactured using a CMOS process that allows a high level of integration to design a dedicated circuit that is trimmed to better match the characteristics of the sensing element.
Documents
Technical documentation and resources