Connectors, Interconnects

XG8T-1441

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Omron Electronics Inc-EMC Div

CONN HEADER VERT 14POS 2.54MM

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Connectors, Interconnects

XG8T-1441

Active

Omron Electronics Inc-EMC Div

CONN HEADER VERT 14POS 2.54MM

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DocumentsHow to Read Date Codes Datasheet

Specifications Series Pricing Description Documents

Technical Specifications

Parameters and characteristics for this part

Specification	XG8T-1441

Connector Type	Header
Contact Finish - Post	Tin
Contact Length - Mating	0.169 in
Contact Length - Mating	4.3 mm
Contact Length - Post	0.118 in
Contact Length - Post	3 mm
Contact Material	Nickel, Brass
Contact Shape	Square
Contact Type	Male Pin
Current Rating (Amps)	2 A
Fastening Type	Push-Pull
Insulation Color	Black
Insulation Height	0.098 "
Insulation Height	2.5 mm
Insulation Material	Polybutylene Terephthalate (PBT), Glass Filled
Material Flammability Rating	UL94 V-0
Mounting Type	Through Hole
Number of Positions	14
Number of Positions Loaded	All
Number of Rows [custom]	2
Operating Temperature [Max]	105 ░C
Operating Temperature [Min]	-55 C
Overall Contact Length	9.8 mm
Overall Contact Length	0.386 in
Pitch - Mating	0.1 "
Pitch - Mating	2.54 mm
Row Spacing - Mating [x]	0.1 in
Row Spacing - Mating [x]	2.54 mm
Shrouding	Unshrouded
Style	Cable, Board to Board
Termination	Solder
Voltage Rating	300 VDC

XG8T Series

Part	Connector Type	Shrouding	Mounting Type	Contact Material	Insulation Color	Operating Temperature [Min]	Operating Temperature [Max]	Insulation Height	Insulation Height	Contact Type	Termination	Number of Positions Loaded	Material Flammability Rating	Row Spacing - Mating [x]	Row Spacing - Mating [x]	Contact Length - Mating	Contact Length - Mating	Contact Length - Post	Contact Length - Post	Overall Contact Length	Overall Contact Length	Pitch - Mating	Pitch - Mating	Voltage Rating	Current Rating (Amps)	Insulation Material	Fastening Type	Contact Finish - Post	Style	Number of Positions	Number of Rows [custom]	Contact Shape	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Contact Finish Thickness - Mating [custom]	Contact Finish Thickness - Mating [custom]	Contact Finish - Mating
Omron Electronics Inc-EMC Div XG8T-1441	Header	Unshrouded	Through Hole	Brass Nickel	Black	-55 C	105 ░C	0.098 "	2.5 mm	Male Pin	Solder	All	UL94 V-0	0.1 in	2.54 mm	0.169 in	4.3 mm	0.118 in	3 mm	9.8 mm	0.386 in	0.1 "	2.54 mm	300 VDC	2 A	Polybutylene Terephthalate (PBT) Glass Filled	Push-Pull	Tin	Board to Board Cable	14	2	Square
Omron Electronics Inc-EMC Div XG8T-0841	Header	Unshrouded	Through Hole	Brass Nickel	Black	-55 C	105 ░C	0.098 "	2.5 mm	Male Pin	Solder	All	UL94 V-0	0.1 in	2.54 mm	0.169 in	4.3 mm	0.118 in	3 mm	9.8 mm	0.386 in	0.1 "	2.54 mm	300 VDC	2 A	Polybutylene Terephthalate (PBT) Glass Filled	Push-Pull	Tin	Board to Board Cable	8	2	Square
Omron Electronics Inc-EMC Div XG8T-0641	Header	Unshrouded	Through Hole	Brass Nickel	Black	-55 C	105 ░C	0.098 "	2.5 mm	Male Pin	Solder	All	UL94 V-0	0.1 in	2.54 mm	0.169 in	4.3 mm	0.118 in	3 mm	9.8 mm	0.386 in	0.1 "	2.54 mm	300 VDC	2 A	Polybutylene Terephthalate (PBT) Glass Filled	Push-Pull	Tin	Board to Board Cable	6	2	Square
Omron Electronics Inc-EMC Div XG8T-1841	Header	Unshrouded	Through Hole	Brass Nickel	Black	-55 C	105 ░C	0.098 "	2.5 mm	Male Pin	Solder	All	UL94 V-0	0.1 in	2.54 mm	0.169 in	4.3 mm	0.118 in	3 mm	9.8 mm	0.386 in	0.1 "	2.54 mm	300 VDC	2 A	Polybutylene Terephthalate (PBT) Glass Filled	Push-Pull	Tin	Board to Board Cable	18	2	Square
Omron Electronics Inc-EMC Div XG8T-0831	Header	Unshrouded	Through Hole	Brass Nickel	Black	-55 C	105 ░C	0.098 "	2.5 mm	Male Pin	Solder	All	UL94 V-0	0.1 in	2.54 mm	0.169 in	4.3 mm	0.118 in	3 mm	9.8 mm	0.386 in	0.1 "	2.54 mm	300 VDC	2 A	Polybutylene Terephthalate (PBT) Glass Filled	Push-Pull	Gold	Board to Board Cable	8	2	Square	0.15 µm	5.9 µin	5.9 µin	0.15 µm	Gold
Omron Electronics Inc-EMC Div XG8T-1831	Header	Unshrouded	Through Hole	Brass Nickel	Black	-55 C	105 ░C	0.098 "	2.5 mm	Male Pin	Solder	All	UL94 V-0	0.1 in	2.54 mm	0.169 in	4.3 mm	0.118 in	3 mm	9.8 mm	0.386 in	0.1 "	2.54 mm	300 VDC	2 A	Polybutylene Terephthalate (PBT) Glass Filled	Push-Pull	Gold	Board to Board Cable	18	2	Square	0.15 µm	5.9 µin	5.9 µin	0.15 µm	Gold
Omron Electronics Inc-EMC Div XG8T-0631	Header	Unshrouded	Through Hole	Brass Nickel	Black	-55 C	105 ░C	0.098 "	2.5 mm	Male Pin	Solder	All	UL94 V-0	0.1 in	2.54 mm	0.169 in	4.3 mm	0.118 in	3 mm	9.8 mm	0.386 in	0.1 "	2.54 mm	300 VDC	2 A	Polybutylene Terephthalate (PBT) Glass Filled	Push-Pull	Gold	Board to Board Cable	6	2	Square	0.15 µm	5.9 µin	5.9 µin	0.15 µm	Gold
Omron Electronics Inc-EMC Div XG8T-0441	Header	Unshrouded	Through Hole	Brass Nickel	Black	-55 C	105 ░C	0.098 "	2.5 mm	Male Pin	Solder	All	UL94 V-0	0.1 in	2.54 mm	0.169 in	4.3 mm	0.118 in	3 mm	9.8 mm	0.386 in	0.1 "	2.54 mm	300 VDC	2 A	Polybutylene Terephthalate (PBT) Glass Filled	Push-Pull	Tin	Board to Board Cable	4	2	Square
Omron Electronics Inc-EMC Div XG8T-1041	Header	Unshrouded	Through Hole	Brass Nickel	Black	-55 C	105 ░C	0.098 "	2.5 mm	Male Pin	Solder	All	UL94 V-0	0.1 in	2.54 mm	0.169 in	4.3 mm	0.118 in	3 mm	9.8 mm	0.386 in	0.1 "	2.54 mm	300 VDC	2 A	Polybutylene Terephthalate (PBT) Glass Filled	Push-Pull	Tin	Board to Board Cable	10	2	Square
Omron Electronics Inc-EMC Div XG8T-1241	Header	Unshrouded	Through Hole	Brass Nickel	Black	-55 C	105 ░C	0.098 "	2.5 mm	Male Pin	Solder	All	UL94 V-0	0.1 in	2.54 mm	0.169 in	4.3 mm	0.118 in	3 mm	9.8 mm	0.386 in	0.1 "	2.54 mm	300 VDC	2 A	Polybutylene Terephthalate (PBT) Glass Filled	Push-Pull	Tin	Board to Board Cable	12	2	Square

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$

Digikey	Bulk	1	$ 1.18
		10	$ 0.90
		100	$ 0.69
		500	$ 0.58
		1000	$ 0.54
		5000	$ 0.46
		10000	$ 0.43
	N/A	200	$ 0.89