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110-83-964-41-001101
Connectors, Interconnects

110-83-964-41-001101

Active
Preci-Dip

CONN IC DIP SOCKET 64POS GOLD

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110-83-964-41-001101
Connectors, Interconnects

110-83-964-41-001101

Active
Preci-Dip

CONN IC DIP SOCKET 64POS GOLD

Deep-Dive with AI

Technical Specifications

Parameters and characteristics for this part

Specification110-83-964-41-001101
Contact Finish - MatingGold
Contact Finish - PostTin
Contact Finish Thickness - Mating [custom]29.5 µin
Contact Finish Thickness - Mating [custom]0.75 µm
Contact Material - MatingBeryllium Copper
Contact Material - Post [custom]Brass
Contact Resistance10 mOhm
Current Rating (Amps)1 A
FeaturesOpen Frame
Housing MaterialPolyester, Glass Filled, Polycyclohexylenedimethylene Terephthalate (PCT)
Material Flammability RatingUL94 V-0
Mounting TypeThrough Hole
Number of Positions or Pins (Grid)64
Number of Positions or Pins (Grid) [x]2
Number of Positions or Pins (Grid) [y]32
Operating Temperature [Max]125 °C
Operating Temperature [Min]-55 C
Pitch - Mating0.1 "
Pitch - Mating2.54 mm
Pitch - Post0.1 in
Pitch - Post2.54 mm
TerminationSolder
Termination Post Length0.125 in
Termination Post Length3.18 mm
TypeDIP
Type22.86 mm
Type0.9 in
...
PartMaterial Flammability RatingContact ResistanceCurrent Rating (Amps)Contact Finish Thickness - Mating [custom]Contact Finish Thickness - Mating [custom]Number of Positions or Pins (Grid) [x]Number of Positions or Pins (Grid) [y]Number of Positions or Pins (Grid)TypeTypeContact Finish - PostMounting TypeHousing MaterialContact Finish - MatingContact Material - Post [custom]TerminationContact Material - MatingPitch - PostPitch - PostFeaturesOperating Temperature [Min]Operating Temperature [Max]Pitch - MatingPitch - MatingTermination Post LengthTermination Post LengthTypeType [custom]Type [custom]Number of Positions or Pins (Grid) [custom]
UL94 V-0
10 mOhm
1 A
29.5 µin
0.75 µm
12
2
24
0.4 in
DIP
Tin
Through Hole
Glass Filled
Polycyclohexylenedimethylene Terephthalate (PCT)
Polyester
Gold
Brass
Solder
Beryllium Copper
0.1 in
2.54 mm
Open Frame
-55 C
125 °C
0.1 "
2.54 mm
UL94 V-0
10 mOhm
1 A
29.5 µin
0.75 µm
20
0.3 in
DIP
Tin
Surface Mount
Glass Filled
Polycyclohexylenedimethylene Terephthalate (PCT)
Polyester
Gold
Brass
Solder
Beryllium Copper
0.1 in
2.54 mm
Open Frame
-55 C
125 °C
0.1 "
2.54 mm
3 mm
0.118 in
7.62 mm
UL94 V-0
10 mOhm
1 A
29.5 µin
0.75 µm
12
2
24
0.3 in
DIP
Tin
Through Hole
Glass Filled
Polycyclohexylenedimethylene Terephthalate (PCT)
Polyester
Gold
Brass
Solder
Beryllium Copper
0.1 in
2.54 mm
No Center Bar
Open Frame
-55 C
125 °C
0.1 "
2.54 mm
3.18 mm
0.125 in
7.62 mm
UL94 V-0
10 mOhm
1 A
29.5 µin
0.75 µm
DIP
Tin
Through Hole
Glass Filled
Polycyclohexylenedimethylene Terephthalate (PCT)
Polyester
Gold
Brass
Solder
Beryllium Copper
0.1 in
2.54 mm
Open Frame
-55 C
125 °C
0.1 "
2.54 mm
15.24 mm
0.6 in
UL94 V-0
10 mOhm
1 A
29.5 µin
0.75 µm
4 pins
0.3 in
DIP
Tin
Surface Mount
Glass Filled
Polycyclohexylenedimethylene Terephthalate (PCT)
Polyester
Gold
Brass
Solder
Beryllium Copper
0.1 in
2.54 mm
Open Frame
-55 C
125 °C
0.1 "
2.54 mm
3 mm
0.118 in
7.62 mm
2 x 2
UL94 V-0
10 mOhm
1 A
29.5 µin
0.75 µm
2
32
64
0.9 in
DIP
Tin
Through Hole
Glass Filled
Polycyclohexylenedimethylene Terephthalate (PCT)
Polyester
Gold
Brass
Solder
Beryllium Copper
0.1 in
2.54 mm
Open Frame
-55 C
125 °C
0.1 "
2.54 mm
3.18 mm
0.125 in
22.86 mm
UL94 V-0
10 mOhm
1 A
29.5 µin
0.75 µm
32
DIP
Tin
Surface Mount
Glass Filled
Polycyclohexylenedimethylene Terephthalate (PCT)
Polyester
Gold
Brass
Solder
Beryllium Copper
0.1 in
2.54 mm
Open Frame
-55 C
125 °C
0.1 "
2.54 mm
3 mm
0.118 in
15.24 mm
0.6 in
UL94 V-0
10 mOhm
1 A
29.5 µin
0.75 µm
14
0.3 in
DIP
Tin
Through Hole
Glass Filled
Polycyclohexylenedimethylene Terephthalate (PCT)
Polyester
Gold
Brass
Solder
Beryllium Copper
0.1 in
2.54 mm
Open Frame
-55 C
125 °C
0.1 "
2.54 mm
3.18 mm
0.125 in
7.62 mm
UL94 V-0
10 mOhm
1 A
29.5 µin
0.75 µm
2
3 positions or pins
6
0.3 in
DIP
Tin
Through Hole
Glass Filled
Polycyclohexylenedimethylene Terephthalate (PCT)
Polyester
Gold
Brass
Solder
Beryllium Copper
0.1 in
2.54 mm
Open Frame
-55 C
125 °C
0.1 "
2.54 mm
3.18 mm
0.125 in
7.62 mm
UL94 V-0
10 mOhm
1 A
29.5 µin
0.75 µm
42
DIP
Tin
Through Hole
Glass Filled
Polycyclohexylenedimethylene Terephthalate (PCT)
Polyester
Gold
Brass
Solder
Beryllium Copper
0.1 in
2.54 mm
Open Frame
-55 C
125 °C
0.1 "
2.54 mm
15.24 mm
0.6 in

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyBulk 1$ 7.86
12$ 7.11
102$ 6.23
504$ 5.24
1002$ 4.59
N/A 177$ 5.24

Description

General part information

110-83 Series

64 (2 x 32) Pos DIP, 0.9" (22.86mm) Row Spacing Socket Gold Through Hole

Documents

Technical documentation and resources

No documents available