Integrated Circuits (ICs)

UPD70F3529GMA9-GBK-G

Obsolete

Renesas Electronics Corporation

MCU 32-BIT V850E2/DX4-H V850E2M RISC 2048KB FLASH 3.3V/5V 176-PIN HLFQFP

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Integrated Circuits (ICs)

UPD70F3529GMA9-GBK-G

Obsolete

Renesas Electronics Corporation

MCU 32-BIT V850E2/DX4-H V850E2M RISC 2048KB FLASH 3.3V/5V 176-PIN HLFQFP

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Specifications Series Pricing Description Documents

Technical Specifications

Parameters and characteristics for this part

Specification	UPD70F3529GMA9-GBK-G

Connectivity	CANbus, UART/USART, I2C, SPI, CSI, LINbus
Core Processor	V850E2M
Core Size	32-Bit Single-Core, 32-Bit
Data Converters	A/D 12x10b, A/D 12x12b
EEPROM Size	32K x 8
Grade	Automotive
Mounting Type	Surface Mount
Number of I/O	127
Operating Temperature [Max]	105 °C
Operating Temperature [Min]	-40 °C
Oscillator Type	Internal
Package / Case	176-LQFP Exposed Pad
Peripherals	DMA, LCD, PWM, POR, LVD, I2S, WDT
Program Memory Size	2 GB
Program Memory Type	FLASH
Qualification	AEC-Q100
RAM Size	96 K
Speed	80 MHz
Supplier Device Package	176-HLQFP (24x24)
Voltage - Supply (Vcc/Vdd) [Max]	5.5 V
Voltage - Supply (Vcc/Vdd) [Min]	2.7 V

V850E2/Dx4-H Series

Part	Core Size	Mounting Type	RAM Size	Peripherals	Core Processor	EEPROM Size	Voltage - Supply (Vcc/Vdd) [Max]	Voltage - Supply (Vcc/Vdd) [Min]	Connectivity	Number of I/O [custom]	Speed	Operating Temperature [Min]	Operating Temperature [Max]	Program Memory Size	Oscillator Type	Data Converters	Program Memory Type	Package / Case	Supplier Device Package	Number of I/O	Supplier Device Package [x]	Supplier Device Package [custom]	Supplier Device Package [y]	Qualification	Grade
Renesas Electronics Corporation UPD70F3537F1A9-MNM-A	32-Bit 32-Bit Single-Core	Surface Mount	256 K	DMA I2S LVD POR PWM WDT	V850E2M	32K x 8	5.5 V	2.7 V	CANbus EBI/EMI Ethernet I2C LINbus SCI SPI SSI UART/USART USB	165	160 MHz	-40 °C	105 °C	3 MB	Internal	A/D 32x10/12b	FLASH	408-BGA
Renesas Electronics Corporation UPD70F3529GMA-GBK-G	32-Bit	Surface Mount	96 K	DMA I2S LCD LVD POR PWM WDT	V850E2M	32K x 8	5.5 V	2.7 V	CANbus EBI/EMI I2C LINbus SCI SPI SSI UART/USART USB		80 MHz	-40 ¯C	85 C	2 MB	Internal	A/D 12x10b A/D 12x12b	FLASH	176-LQFP Exposed Pad	176-HLQFP (24x24)	127
Renesas Electronics Corporation UPD70F3532F1A9-KN7-A	32-Bit	Surface Mount	256 K	DMA I2S LCD LVD POR PWM WDT	V850E2M	32K x 8	5.5 V	2.7 V	CANbus EBI/EMI I2C LINbus SCI SPI SSI UART/USART USB	165	160 MHz	-40 °C	105 °C	3 MB	Internal	16x10b 16x12b	FLASH	352-BGA			23	352-BGA	23
Renesas Electronics Corporation UPD70F3529GMA9-GBK-G	32-Bit 32-Bit Single-Core	Surface Mount	96 K	DMA I2S LCD LVD POR PWM WDT	V850E2M	32K x 8	5.5 V	2.7 V	CANbus CSI I2C LINbus SPI UART/USART		80 MHz	-40 °C	105 °C	2 GB	Internal	A/D 12x10b A/D 12x12b	FLASH	176-LQFP Exposed Pad	176-HLQFP (24x24)	127				AEC-Q100	Automotive

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$

Digikey	N/A	0	$ 0.00

Description

General part information

V850E2/Dx4-H Series

ROM: 3 MB flash memory

Data flash: 32 KB

RAM: 256 KB

Documents

Technical documentation and resources

No documents available