V850E2/Dx4-H Series
Manufacturer: Renesas Electronics Corporation
IC MCU 32BIT 3MB FLASH 408BGA
| Part | Core Size | Mounting Type | RAM Size | Peripherals | Core Processor | EEPROM Size | Voltage - Supply (Vcc/Vdd) [Max] | Voltage - Supply (Vcc/Vdd) [Min] | Connectivity | Number of I/O [custom] | Speed | Operating Temperature [Min] | Operating Temperature [Max] | Program Memory Size | Oscillator Type | Data Converters | Program Memory Type | Package / Case | Supplier Device Package | Number of I/O | Supplier Device Package [x] | Supplier Device Package [custom] | Supplier Device Package [y] | Qualification | Grade |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Renesas Electronics Corporation | 32-Bit 32-Bit Single-Core | Surface Mount | 256 K | DMA I2S LVD POR PWM WDT | V850E2M | 32K x 8 | 5.5 V | 2.7 V | CANbus EBI/EMI Ethernet I2C LINbus SCI SPI SSI UART/USART USB | 165 | 160 MHz | -40 °C | 105 °C | 3 MB | Internal | A/D 32x10/12b | FLASH | 408-BGA | |||||||
Renesas Electronics Corporation | 32-Bit | Surface Mount | 96 K | DMA I2S LCD LVD POR PWM WDT | V850E2M | 32K x 8 | 5.5 V | 2.7 V | CANbus EBI/EMI I2C LINbus SCI SPI SSI UART/USART USB | 80 MHz | -40 ¯C | 85 C | 2 MB | Internal | A/D 12x10b A/D 12x12b | FLASH | 176-LQFP Exposed Pad | 176-HLQFP (24x24) | 127 | ||||||
Renesas Electronics Corporation | 32-Bit | Surface Mount | 256 K | DMA I2S LCD LVD POR PWM WDT | V850E2M | 32K x 8 | 5.5 V | 2.7 V | CANbus EBI/EMI I2C LINbus SCI SPI SSI UART/USART USB | 165 | 160 MHz | -40 °C | 105 °C | 3 MB | Internal | 16x10b 16x12b | FLASH | 352-BGA | 23 | 352-BGA | 23 | ||||
Renesas Electronics Corporation | 32-Bit 32-Bit Single-Core | Surface Mount | 96 K | DMA I2S LCD LVD POR PWM WDT | V850E2M | 32K x 8 | 5.5 V | 2.7 V | CANbus CSI I2C LINbus SPI UART/USART | 80 MHz | -40 °C | 105 °C | 2 GB | Internal | A/D 12x10b A/D 12x12b | FLASH | 176-LQFP Exposed Pad | 176-HLQFP (24x24) | 127 | AEC-Q100 | Automotive |