Discrete Semiconductor Products

IKCM30F60GDXKMA1

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600 V, 30 A CIPOS™ MINI 3 PHASE OPEN EMITTER INTELLIGENT POWER MODULE (IPM) WITH TRENCHSTOP™ IGBT AND BUILT IN NTC IN MDIP-24 DCB PACKAGE.

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DocumentsTechnical Data Sheet EN

Discrete Semiconductor Products

IKCM30F60GDXKMA1

Active

INFINEON

600 V, 30 A CIPOS™ MINI 3 PHASE OPEN EMITTER INTELLIGENT POWER MODULE (IPM) WITH TRENCHSTOP™ IGBT AND BUILT IN NTC IN MDIP-24 DCB PACKAGE.

Deep-Dive with AI

DocumentsTechnical Data Sheet EN

Specifications Series Pricing Description Documents

Technical Specifications

Parameters and characteristics for this part

Specification	IKCM30F60GDXKMA1

Configuration	3 Phase
Current	30 A
Mounting Type	Through Hole
Package / Case	1.028 ", 26.1 mm
Package / Case	24-PowerDIP Module
Type	IGBT
Voltage	600 V
Voltage - Isolation	2000 Vrms

CIPOS Mini Series

Part	Voltage	Type	Mounting Type	Current	Package / Case	Package / Case	Configuration	Voltage - Isolation	Operating Temperature [Max]	Operating Temperature [Min]	Applications	Motor Type - AC, DC	Technology	Function	Current - Output	Output Configuration	Voltage - Load [Max]	Voltage - Load [Min]	Supplier Device Package	Motor Type - Stepper	Voltage - Supply [Min]	Voltage - Supply [Max]	Interface	Grade	Qualification	Program Memory Type [custom]	Program Memory Type [custom]	Number of I/O	RAM Size	Core Processor
INFINEON IKCM30F60GDXKMA1	600 V	IGBT	Through Hole	30 A	1.028 " 26.1 mm	24-PowerDIP Module	3 Phase	2000 Vrms
INFINEON IM523S6AXKMA1			Through Hole		1.028 " 26.1 mm	24-PowerDIP Module			125 °C	-40 C	Appliance	Brushless DC (BLDC)	IGBT	Driver - Fully Integrated Control and Power Stage	12 A	Half Bridge (3)	450 V	0 V	24-DIP	Multiphase	13 V	17.5 V
INFINEON TLE7184F3VXUMA2									150 °C	-40 °C		Brushed DC Brushless DC (BLDC)	Power MOSFET	Controller - Commutation Direction Management		Pre-Driver - Half Bridge (3)					6 V	45 V	Parallel	Automotive
INFINEON IGCM20F60GAXKMA1	600 V	IGBT	Through Hole	20 A	1.028 " 26.1 mm	24-PowerDIP Module	3 Phase	2000 Vrms
INFINEON IKCM10H60GAXKMA1	600 V	IGBT	Through Hole	10 A	1.028 " 26.1 mm	24-PowerDIP Module	3 Phase	2000 Vrms
INFINEON IGCM04G60HAXKMA1	600 V	IGBT	Through Hole	4 A	1.028 " 26.1 mm	24-PowerDIP Module	3 Phase	2000 Vrms
INFINEON IKCM30F60GAXKMA1	600 V	IGBT	Through Hole	30 A	1.028 " 26.1 mm	24-PowerDIP Module	3 Phase	2000 Vrms
INFINEON TLE9879QXA40XUMA1			Surface Mount			48-VFQFN Exposed Pad			150 °C	-40 C									PG-VQFN-48-31		5.5 V	28 V	LIN SSI UART	Automotive	AEC-Q100	FLASH	128 kB	10	6 K	ARM® Cortex®-M3
INFINEON TLE7184FXUMA2			Surface Mount			48-VQFN Exposed Pad			150 °C	-40 °C		Brushed DC Brushless DC (BLDC)	Power MOSFET	Controller - Commutation Direction Management		Pre-Driver - Half Bridge (3)			PG-VQFN-48-72		6 V	45 V	PWM	Automotive
INFINEON IKCM15L60GDXKMA1	600 V	IGBT	Through Hole	20 A	1.028 " 26.1 mm	24-PowerDIP Module	3 Phase	2000 Vrms

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$

Digikey	N/A	41	$ 18.39
Mouser	N/A	1	$ 19.15
		10	$ 14.88
		100	$ 14.29
		280	$ 13.73
		560	$ 13.18

Description

General part information

CIPOS Mini Series

CIPOS™ Mini600 V, 30 A three-phase TRENCHSTOP™IGBTbasedintelligent power modulewith open emitter in DIP 36x21D package. It provides fully featured compact inverter solutions with DCB substrate to enable excellent thermal performance and higher power capability along with excellent thermal conduction and electrical isolation. Performance is optimized for home appliances and industrial drives.

Documents

Technical documentation and resources

Technical Data Sheet EN

Datasheet