Connectors, Interconnects

ICS-640-T

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IC & COMPONENT SOCKETS 40P / .600"

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Connectors, Interconnects

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IC & COMPONENT SOCKETS 40P / .600"

Technical Specifications

Parameters and characteristics for this part

Specification	ICS-640-T

Contact Finish - Post	Tin
Contact Material - Mating	Phosphor Bronze
Contact Material - Post	Phosphor Bronze
Features	Open Frame
Housing Material	Polybutylene Terephthalate (PBT), Glass Filled
Mounting Type	Through Hole
Number of Positions or Pins (Grid)	40
Operating Temperature [Max]	105 ░C
Operating Temperature [Min]	-55 C
Pitch - Mating	0.1 "
Pitch - Mating	2.54 mm
Pitch - Post	0.1 in
Pitch - Post	2.54 mm
Termination	Solder
Type	DIP
Type [custom]	15.24 mm
Type [custom]	0.6 in

Part	Termination	Type	Type	Type	Features	Operating Temperature [Min]	Operating Temperature [Max]	Contact Finish - Post	Contact Finish - Mating	Contact Material - Post	Number of Positions or Pins (Grid) [x]	Number of Positions or Pins (Grid) [y]	Number of Positions or Pins (Grid)	Contact Finish Thickness - Mating	Contact Material - Mating	Pitch - Mating	Pitch - Mating	Pitch - Post	Pitch - Post	Mounting Type	Termination Post Length	Termination Post Length	Contact Resistance	Material Flammability Rating	Current Rating (Amps)	Type [custom]	Type [custom]	Housing Material
Adam Tech ICM-324-1-GT-HT	Solder	7.62 mm	0.3 in	DIP	Open Frame	-40 C	105 ░C	Tin	Gold	Beryllium Copper	12	2	24	Flash	Beryllium Copper	0.1 "	2.54 mm	0.1 in	2.54 mm	Through Hole
Adam Tech ICM-642-1-GT-HT	Solder			DIP	Open Frame	-40 C	105 ░C	Tin	Gold	Beryllium Copper			42	Flash	Beryllium Copper	0.1 "	2.54 mm	0.1 in	2.54 mm	Through Hole	0.11 in	2.78 mm	4 mOhm	UL94 V-0	3 A	15.24 mm	0.6 in
Adam Tech ICS-640-T	Solder			DIP	Open Frame	-55 C	105 ░C	Tin		Phosphor Bronze			40		Phosphor Bronze	0.1 "	2.54 mm	0.1 in	2.54 mm	Through Hole						15.24 mm	0.6 in	Polybutylene Terephthalate (PBT) Glass Filled

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General part information

IC & COMPONENT SOCKETS 40P / .600"

Technical documentation and resources