
Deep-Dive with AI
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DocumentsQB2525B60WSC | Datasheet

Deep-Dive with AI
DocumentsQB2525B60WSC | Datasheet
Technical Specifications
Parameters and characteristics for this part
| Specification | QB2525B60WSC |
|---|---|
| Material | Beryllium Oxide |
| Outline [x] | 6.1 mm |
| Outline [y] | 6.35 mm |
| Thermal Conductivity | 240 W/m-K, 380 W/m-K |
| Thermal Resistivity | 3 °C/W |
| Thermal Resistivity | 4 °C/W |
| Thickness | 1.52 mm |
| Thickness | 0.0598 " |
| Type | Thermal Bridge Jumper |
| Usage | Heat Transfer |
Pricing
Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly
| Distributor | Package | Quantity | $ | |
|---|---|---|---|---|
| Digikey | N/A | 0 | $ 13.30 | |
| Tray | 100 | $ 13.30 | ||
Description
General part information
QB2525 Series
Thermal Pad 6.10mm x 6.35mm
Documents
Technical documentation and resources