Specification	601F

Attachment Method	Thermal Tape, Adhesive
Fin Height	14.28 mm, 0.562 "
Length	50.8 mm
Length	2 in
Material	Aluminum
Material Finish	Black Anodized
Package Cooled	TO-66
Power Dissipation @ Temperature Rise	5 W, 50 °C
Shape [custom]	Rectangular
Shape [custom]	Fins
Thermal Resistance @ Forced Air Flow	5.85 °C/W
Type	Board Level
Width [x]	1.25 in
Width [x]	31.75 mm

601 Series

Heat Sinks Low Height Heat Sink for Power Semic T066, DO4/DO5 Diodes, 50.8x31.8x14.3mm

Part	Package Cooled	Thermal Resistance @ Forced Air Flow	Width [x]	Width [x]	Type	Material Finish	Shape [custom]	Shape [custom]	Power Dissipation @ Temperature Rise	Length	Length	Material	Attachment Method	Fin Height
Wakefield Thermal Solutions 601F	TO-66	5.85 °C/W	1.25 in	31.75 mm	Board Level	Black Anodized	Rectangular	Fins	5 W 50 °C	50.8 mm	2 in	Aluminum	Thermal Tape Adhesive	0.562 " 14.28 mm
Wakefield Thermal Solutions 601F	TO-66	5.85 °C/W	1.25 in	31.75 mm	Board Level	Black Anodized	Rectangular	Fins	5 W 50 °C	50.8 mm	2 in	Aluminum	Thermal Tape Adhesive	0.562 " 14.28 mm

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

General part information

Heat Sinks Low Height Heat Sink for Power Semic T066, DO4/DO5 Diodes, 50.8x31.8x14.3mm

Technical documentation and resources