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TO-39 TO-205AD
Discrete Semiconductor Products

JANKCC2N3499

Active
Microchip Technology

SMALL-SIGNAL BJT DIE ROHS COMPLIANT: YES

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Search across all available documentation for this part.

Documents2N3498 2N3499 2N3500 2N3501Product Change Notice EN
TO-39 TO-205AD
Discrete Semiconductor Products

JANKCC2N3499

Active
Microchip Technology

SMALL-SIGNAL BJT DIE ROHS COMPLIANT: YES

Deep-Dive with AI

Documents2N3498 2N3499 2N3500 2N3501Product Change Notice EN

Technical Specifications

Parameters and characteristics for this part

SpecificationJANKCC2N3499
Current - Collector (Ic) (Max) [Max]500 mA
Current - Collector Cutoff (Max) [Max]10 µA
DC Current Gain (hFE) (Min) @ Ic, Vce [Min]100
GradeMilitary
Mounting TypeThrough Hole
Package / CaseTO-39-3 Metal Can, TO-205AD
Power - Max [Max]1 W
QualificationMIL-PRF-19500/366
Supplier Device PackageTO-39 (TO-205AD)
Transistor TypeNPN
Vce Saturation (Max) @ Ib, Ic600 mV
Voltage - Collector Emitter Breakdown (Max) [Max]100 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyTape & Reel (TR) 100$ 15.49
Microchip DirectN/A 1$ 16.67
NewarkEach 100$ 15.48
500$ 14.89

Description

General part information

JANKCC2N3499-Transistor-Die Series

This specification covers the performance requirements for NPN, silicon, radiation hardened, low power amplifier and switching 2N3498, 2N3499, 2N3500 and 2N3501 transistors. Four levels of product assurance are provided for each encapsulated device (JAN, JANTX, JANTXV and JANS) as specified in MIL-PRF-19500/366. Two levels of product assurance are provided for unencapsulated die (JANHC and JANKC). RHA level designators "E", "K", "U", "M", "D", "P", "L", "R" and, "F " are appended to the device prefix to identify devices, which have passed RHA requirements. The device package for the encapsulated device type are as follows: TO-5, TO-39 and surface mount versions (UB only and U4 suffix versions). The dimensions and topography for JANHC and JANKC unencapsulated die are as outlined in MIL-PRF-19500/366.