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16 TSSOP
Integrated Circuits (ICs)

AD7819YRUZ-REEL

Active
Analog Devices

+2.7 V TO +5.5 V, 200 KSPS 8-BIT SAMPLING ADC

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16 TSSOP
Integrated Circuits (ICs)

AD7819YRUZ-REEL

Active
Analog Devices

+2.7 V TO +5.5 V, 200 KSPS 8-BIT SAMPLING ADC

Technical Specifications

Parameters and characteristics for this part

SpecificationAD7819YRUZ-REEL
ArchitectureSAR
ConfigurationS/H-ADC
Data InterfaceParallel
Input TypeSingle Ended
Mounting TypeSurface Mount
Number of A/D Converters1
Number of Bits8
Number of Inputs1
Operating Temperature [Max]125 °C
Operating Temperature [Min]-40 °C
Package / Case16-TSSOP
Package / Case [x]0.173 in
Package / Case [y]4.4 mm
Ratio - S/H:ADC1:1
Reference TypeExternal
Sampling Rate (Per Second)200k
Supplier Device Package16-TSSOP
Voltage - Supply, Analog [Max]5.5 V
Voltage - Supply, Analog [Min]2.7 V
Voltage - Supply, Digital [Max]5.5 V
Voltage - Supply, Digital [Min]2.7 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyTape & Reel (TR) 2500$ 5.20

Description

General part information

AD7819 Series

The AD7819 is a high speed, microprocessor-compatible, 8-bit analog-to-digital converter with a maximum throughput of 200 kSPS. The converter operates off a single +2.7 V to +5.5 V supply and contains a 4.5 µs successive approximation A/D converter, track/hold circuitry, on-chip clock oscillator and 8-bit wide parallel interface. The parallel interface is designed to allow easy interfacing to microprocessors and DSPs. Using only address decoding logic the AD7819 is easily mapped into the microprocessor address space.When used in its power-down mode, the AD7819 automatically powers down at the end of a conversion and powers up at the start of a new conversion. This feature significantly reduces the power consumption of the part at lower throughput rates. The AD7819 can also operate in a high speed mode where the part is not powered down between conversions. In this mode of operation the part is capable of providing 200 kSPS throughput.The part is available in a small, 16-pin 0.3" wide, plastic dual-in-line package (DIP); in a 16-pin, 0.15" wide, narrow body small outline IC (SOIC) and in a 16-pin, narrow body, thin shrink small outline package (TSSOP).