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Discrete Semiconductor Products

DTC143ZKAT146

Active
Rohm Semiconductor

NPN, SOT-346, R1≠R2 LEAK ABSORPTION TYPE DIGITAL TRANSISTOR (BIAS RESISTOR BUILT-IN TRANSISTOR)

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Product dimension image
Discrete Semiconductor Products

DTC143ZKAT146

Active
Rohm Semiconductor

NPN, SOT-346, R1≠R2 LEAK ABSORPTION TYPE DIGITAL TRANSISTOR (BIAS RESISTOR BUILT-IN TRANSISTOR)

Technical Specifications

Parameters and characteristics for this part

SpecificationDTC143ZKAT146
Current - Collector (Ic) (Max) [Max]100 mA
Current - Collector Cutoff (Max) [Max]500 nA
DC Current Gain (hFE) (Min) @ Ic, Vce [Min]80
Frequency - Transition250 MHz
Mounting TypeSurface Mount
Package / CaseSOT-23-3, TO-236-3, SC-59
Power - Max [Max]200 mW
Resistor - Base (R1)4.7 kOhms
Resistor - Emitter Base (R2)47 kOhms
Supplier Device PackageSMT3
Transistor TypeNPN - Pre-Biased
Vce Saturation (Max) @ Ib, Ic300 mV
Voltage - Collector Emitter Breakdown (Max) [Max]50 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyCut Tape (CT) 1$ 0.22
10$ 0.13
100$ 0.08
500$ 0.06
1000$ 0.05
Digi-Reel® 1$ 0.22
10$ 0.13
100$ 0.08
500$ 0.06
1000$ 0.05
Tape & Reel (TR) 3000$ 0.04
6000$ 0.03
9000$ 0.03
15000$ 0.03
21000$ 0.03
30000$ 0.03
75000$ 0.02
150000$ 0.02
NewarkEach 1$ 0.16
10$ 0.10
100$ 0.05
500$ 0.05
1000$ 0.05
2500$ 0.04
12000$ 0.03
27000$ 0.03

Description

General part information

DTC143 Series

DTC143TU3HZG is an digital transistor (Resistor built-in type transistor). Built-in bias resistors enable the configuration of an inverter circuit without connecting external input resistors. This is a high-reliability product of automotive grade qualified to AEC-Q101.

Documents

Technical documentation and resources

Notes for Temperature Measurement Using Forward Voltage of PN Junction

Thermal Design

Part Explanation

Application Note

DTC143ZKA Data Sheet

Data Sheet

List of Transistor Package Thermal Resistance

Thermal Design

Method for Calculating Junction Temperature from Transient Thermal Resistance Data

Thermal Design

Importance of Probe Calibration When Measuring Power: Deskew

Schematic Design & Verification

Two-Resistor Model for Thermal Simulation

Thermal Design

Calculation of Power Dissipation in Switching Circuit

Schematic Design & Verification

Notes for Calculating Power Consumption:Static Operation

Thermal Design

Compliance of the RoHS directive

Environmental Data

How to Use LTspice® Models: Tips for Improving Convergence

Schematic Design & Verification

Explanation for Marking

Package Information

How to Create Symbols for PSpice Models

Models

Temperature derating method for Safe Operating Area (SOA)

Schematic Design & Verification

Anti-Whisker formation - Transistors

Package Information

Types and Features of Transistors

Application Note

What is a Thermal Model? (Transistor)

Thermal Design

Package Dimensions

Package Information

ESD Data

Characteristics Data

About Flammability of Materials

Environmental Data

Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)

Technical Article

Reliability Test Result

Manufacturing Data

Measurement Method and Usage of Thermal Resistance RthJC

Thermal Design

Moisture Sensitivity Level - Transistors

Package Information

Notes for Temperature Measurement Using Thermocouples

Thermal Design

About Export Regulations

Export Information

Impedance Characteristics of Bypass Capacitor

Schematic Design & Verification

PCB Layout Thermal Design Guide

Thermal Design

Method for Monitoring Switching Waveform

Schematic Design & Verification

What Is Thermal Design

Thermal Design

Condition of Soldering / Land Pattern Reference

Package Information

Certificate of not containing SVHC under REACH Regulation

Environmental Data

Taping Information

Package Information

Basics of Thermal Resistance and Heat Dissipation

Thermal Design

Inner Structure

Package Information

How to Use LTspice® Models

Schematic Design & Verification

Precautions When Measuring the Rear of the Package with a Thermocouple

Thermal Design