Specification	10018783-10100TLF

Card Thickness	1.57 mm
Card Thickness	0.062 in
Card Type	PCI Express™
Color	Black
Contact Finish	Gold
Contact Finish Thickness	0.38 µm
Contact Finish Thickness	15 µin
Contact Material	Copper Alloy
Contact Type	Cantilever
Features	Locking Ramp, Board Guide
Gender	Female
Material - Insulation	Nylon, Glass Filled, Polyamide (PA)
Mounting Type	Through Hole
Number of Positions	36
Number of Rows [custom]	2
Operating Temperature [Max]	85 °C
Operating Temperature [Min]	-55 C
Pitch	1 mm
Pitch	0.039 in
Read Out	Dual
Termination	Solder, Staggered

10018783 Series

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Part	Material - Insulation	Number of Rows [custom]	Mounting Type	Contact Finish Thickness	Contact Finish Thickness	Gender	Card Type	Features	Color	Operating Temperature [Min]	Operating Temperature [Max]	Read Out	Contact Material	Contact Finish	Pitch	Pitch	Number of Positions	Card Thickness	Card Thickness	Termination	Contact Type	Contact Finish Thickness	Number of Positions/Bay/Row [custom]	Number of Positions/Bay/Row [custom]
Amphenol ICC (FCI) 10018783-10100MLF	Glass Filled Nylon Polyamide (PA)	2	Through Hole	30 Áin	0.76 Ám	Female	PCI Express™	Board Guide Locking Ramp	Black	-55 C	85 °C	Dual	Copper Alloy	Gold	1 mm	0.039 in	36	1.57 mm	0.062 in	Solder Staggered	Cantilever
Amphenol ICC (FCI) 10018783-10211TLF	Glass Filled Nylon Polyamide (PA)	2	Through Hole			Female	PCI Express™	Board Guide Locking Ramp	Black	-55 C	85 °C	Dual	Copper Alloy	Gold	1 mm	0.039 in	64	1.57 mm	0.062 in	Solder Staggered	Cantilever	Flash	21	11
Amphenol ICC (FCI) 10018783-11222TLF	Glass Filled Nylon Polyamide (PA)	2	Through Hole			Female	PCI Express™	Board Lock Locking Ramp	Black	-55 C	85 °C	Dual	Copper Alloy	Gold	1 mm	0.039 in	98	1.57 mm	0.062 in	Solder Staggered	Cantilever	Flash
Amphenol ICC (FCI) 10018783-10010TLF	Glass Filled Nylon Polyamide (PA)	2	Through Hole	30 Áin	0.76 Ám	Female	PCI Express™	Board Guide Locking Ramp	Black	-55 C	85 °C	Dual	Copper Alloy	Gold	1 mm	0.039 in	36	1.57 mm	0.062 in	Solder Staggered	Cantilever
Amphenol ICC (FCI) 10018783-10002TLF	Glass Filled Nylon Polyamide (PA)	2	Through Hole	30 Áin	0.76 Ám	Female	PCI Express™	Board Guide Locking Ramp	Black	-55 C	85 °C	Dual	Copper Alloy	Gold	1 mm	0.039 in	98	1.57 mm	0.062 in	Solder Staggered	Cantilever
Amphenol ICC (FCI) 10018783-10100TLF	Glass Filled Nylon Polyamide (PA)	2	Through Hole	15 µin	0.38 µm	Female	PCI Express™	Board Guide Locking Ramp	Black	-55 C	85 °C	Dual	Copper Alloy	Gold	1 mm	0.039 in	36	1.57 mm	0.062 in	Solder Staggered	Cantilever
Amphenol ICC (FCI) 10018783-11203TLF	Glass Filled Nylon Polyamide (PA)	2	Through Hole	30 Áin	0.76 Ám	Female	PCI Express™	Board Guide Locking Ramp	Black	-55 C	85 °C	Dual	Copper Alloy	Gold	1 mm	0.039 in	164	1.57 mm	0.062 in	Solder Staggered	Cantilever
Amphenol ICC (FCI) 10018783-12202TLF	Glass Filled Nylon Polyamide (PA)	2	Through Hole	30 Áin	0.76 Ám	Female	PCI Express™	Board Guide Locking Ramp	Black	-55 C	85 °C	Dual	Copper Alloy	Gold	1 mm	0.039 in	98	1.57 mm	0.062 in	Solder Staggered	Cantilever
Amphenol ICC (FCI) 10018783-10202MLF	Glass Filled Nylon Polyamide (PA)	2	Through Hole	30 Áin	0.76 Ám	Female	PCI Express™	Board Guide Locking Ramp	Black	-55 C	85 °C	Dual	Copper Alloy	Gold	1 mm	0.039 in	98	1.57 mm	0.062 in	Solder Staggered	Cantilever
Amphenol ICC (FCI) 10018783-00203TLF	Glass Filled Nylon Polyamide (PA)	2	Through Hole	30 Áin	0.76 Ám	Female	PCI Express™	Board Guide Locking Ramp	White	-55 C	85 °C	Dual	Copper Alloy	Gold	1 mm	0.039 in	164	1.57 mm	0.062 in	Solder Staggered	Cantilever