10018783 Series
Manufacturer: Amphenol ICC (FCI)
CONN PCI EXP FMALE 36POS 0.039
| Part | Material - Insulation | Number of Rows [custom] | Mounting Type | Contact Finish Thickness | Contact Finish Thickness | Gender | Card Type | Features | Color | Operating Temperature [Min] | Operating Temperature [Max] | Read Out | Contact Material | Contact Finish | Pitch | Pitch | Number of Positions | Card Thickness | Card Thickness | Termination | Contact Type | Contact Finish Thickness | Number of Positions/Bay/Row [custom] | Number of Positions/Bay/Row [custom] |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Amphenol ICC (FCI) | Glass Filled Nylon Polyamide (PA) | 2 | Through Hole | 30 Áin | 0.76 Ám | Female | PCI Express™ | Board Guide Locking Ramp | Black | -55 C | 85 °C | Dual | Copper Alloy | Gold | 1 mm | 0.039 in | 36 | 1.57 mm | 0.062 in | Solder Staggered | Cantilever | |||
Amphenol ICC (FCI) | Glass Filled Nylon Polyamide (PA) | 2 | Through Hole | Female | PCI Express™ | Board Guide Locking Ramp | Black | -55 C | 85 °C | Dual | Copper Alloy | Gold | 1 mm | 0.039 in | 64 | 1.57 mm | 0.062 in | Solder Staggered | Cantilever | Flash | 21 | 11 | ||
Amphenol ICC (FCI) | Glass Filled Nylon Polyamide (PA) | 2 | Through Hole | Female | PCI Express™ | Board Lock Locking Ramp | Black | -55 C | 85 °C | Dual | Copper Alloy | Gold | 1 mm | 0.039 in | 98 | 1.57 mm | 0.062 in | Solder Staggered | Cantilever | Flash | ||||
Amphenol ICC (FCI) | Glass Filled Nylon Polyamide (PA) | 2 | Through Hole | 30 Áin | 0.76 Ám | Female | PCI Express™ | Board Guide Locking Ramp | Black | -55 C | 85 °C | Dual | Copper Alloy | Gold | 1 mm | 0.039 in | 36 | 1.57 mm | 0.062 in | Solder Staggered | Cantilever | |||
Amphenol ICC (FCI) | Glass Filled Nylon Polyamide (PA) | 2 | Through Hole | 30 Áin | 0.76 Ám | Female | PCI Express™ | Board Guide Locking Ramp | Black | -55 C | 85 °C | Dual | Copper Alloy | Gold | 1 mm | 0.039 in | 98 | 1.57 mm | 0.062 in | Solder Staggered | Cantilever | |||
Amphenol ICC (FCI) | Glass Filled Nylon Polyamide (PA) | 2 | Through Hole | 15 µin | 0.38 µm | Female | PCI Express™ | Board Guide Locking Ramp | Black | -55 C | 85 °C | Dual | Copper Alloy | Gold | 1 mm | 0.039 in | 36 | 1.57 mm | 0.062 in | Solder Staggered | Cantilever | |||
Amphenol ICC (FCI) | Glass Filled Nylon Polyamide (PA) | 2 | Through Hole | 30 Áin | 0.76 Ám | Female | PCI Express™ | Board Guide Locking Ramp | Black | -55 C | 85 °C | Dual | Copper Alloy | Gold | 1 mm | 0.039 in | 164 | 1.57 mm | 0.062 in | Solder Staggered | Cantilever | |||
Amphenol ICC (FCI) | Glass Filled Nylon Polyamide (PA) | 2 | Through Hole | 30 Áin | 0.76 Ám | Female | PCI Express™ | Board Guide Locking Ramp | Black | -55 C | 85 °C | Dual | Copper Alloy | Gold | 1 mm | 0.039 in | 98 | 1.57 mm | 0.062 in | Solder Staggered | Cantilever | |||
Amphenol ICC (FCI) | Glass Filled Nylon Polyamide (PA) | 2 | Through Hole | 30 Áin | 0.76 Ám | Female | PCI Express™ | Board Guide Locking Ramp | Black | -55 C | 85 °C | Dual | Copper Alloy | Gold | 1 mm | 0.039 in | 98 | 1.57 mm | 0.062 in | Solder Staggered | Cantilever | |||
Amphenol ICC (FCI) | Glass Filled Nylon Polyamide (PA) | 2 | Through Hole | 30 Áin | 0.76 Ám | Female | PCI Express™ | Board Guide Locking Ramp | White | -55 C | 85 °C | Dual | Copper Alloy | Gold | 1 mm | 0.039 in | 164 | 1.57 mm | 0.062 in | Solder Staggered | Cantilever |