Integrated Circuits (ICs)

A3P1000-PQG208

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PROASIC3 FPGA, 11KLES 208 MQFP 28X28X3.4MM TRAY ROHS COMPLIANT: YES

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Integrated Circuits (ICs)

Active

PROASIC3 FPGA, 11KLES 208 MQFP 28X28X3.4MM TRAY ROHS COMPLIANT: YES

Technical Specifications

Parameters and characteristics for this part

Ultra Low Density FPGAs

Part	Mounting Type	Package / Case	Number of I/O	Total RAM Bits	Voltage - Supply [Max]	Voltage - Supply [Min]	Number of Gates	Operating Temperature [Max]	Operating Temperature [Min]	Supplier Device Package	Qualification	Grade
Microchip Technology A3P1000-PQG208I	Surface Mount	208-BFQFP	154	147456 bits	1.575 V	1.425 V	1000000	100 °C	-40 C	208-PQFP (28x28)
Microchip Technology A3P1000-2FG484	Surface Mount	484-BGA	300 I/O	147456 bits	1.575 V	1.425 V	1000000	85 °C	0 °C	484-FPBGA (23x23)
Microchip Technology A3P1000-1FG256	Surface Mount	256-LBGA	177	147456 bits	1.575 V	1.425 V	1000000	85 °C	0 °C	256-FPBGA (17x17)
Microchip Technology A3P1000-FG484T	Surface Mount	484-BGA	300 I/O	147456 bits	1.575 V	1.425 V	1000000	125 °C	-40 °C	484-FPBGA (23x23)	AEC-Q100	Automotive
Microchip Technology A3P1000-1FGG256M	Surface Mount	256-LBGA	177	147456 bits	1.575 V	1.14 V	1000000	125 ¯C	-55 °C	256-FPBGA (17x17)
Microchip Technology A3P1000-PQG208	Surface Mount	208-BFQFP	154	147456 bits	1.575 V	1.425 V	1000000	85 °C	0 °C	208-PQFP (28x28)
Microchip Technology A3P1000-1FG144T	Surface Mount	144-LBGA	97	147456 bits	1.575 V	1.425 V	1000000	125 °C	-40 °C	13x13 144-FPBGA	AEC-Q100	Automotive
Microchip Technology A3P1000-1PQG208M	Surface Mount	208-BFQFP	154	147456 bits	1.575 V	1.425 V	1000000	125 ¯C	-55 °C	208-PQFP (28x28)
Microchip Technology A3P1000-FGG256M	Surface Mount	256-LBGA	177	147456 bits	1.575 V	1.14 V	1000000	125 ¯C	-55 °C	256-FPBGA (17x17)
Microchip Technology A3P1000-FG484	Surface Mount	484-BGA	300 I/O	147456 bits	1.575 V	1.425 V	1000000	85 °C	0 °C	484-FPBGA (23x23)

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

General part information

ProASIC3

offers high performance in ultra low density FPGAs, a single-chip solution,

small footprint packages, reprogrammability, and an abundance of advanced

Technical documentation and resources