Specification	BM10NB(0.6)-50DS-0.4V(51)

Connector Type	Receptacle, Center Strip Contacts
Contact Finish	Gold
Features	Solder Retention
Height Above Board [z]	0.024 in
Height Above Board [z]	0.61 mm
Mated Stacking Heights	0.6 mm
Mounting Type	Surface Mount
Number of Positions	50
Number of Rows [custom]	2
Pitch	0.4 mm
Pitch	0.016 in

BM10 Series

Board to Board & Mezzanine Connectors 0.4MM FPC TO BOARD 10P RECP 0.6 HGHT

Part	Features	Height Above Board [z]	Height Above Board [z]	Contact Finish	Connector Type	Number of Rows [custom]	Number of Positions	Pitch	Pitch	Mounting Type	Mated Stacking Heights
Hirose Electric Co Ltd BM10NB(0.8)-44DS-0.4V(51)	Solder Retention	0.8 mm	0.031 in	Gold	Receptacle Center Strip Contacts	2	44	0.4 mm	0.016 in	Surface Mount	0.8 mm
Hirose Electric Co Ltd BM10NB(0.6)-50DS-0.4V(51)	Solder Retention	0.61 mm	0.024 in	Gold	Receptacle Center Strip Contacts	2	50	0.4 mm	0.016 in	Surface Mount	0.6 mm
Hirose Electric Co Ltd BM10NB(0.8)-24DS-0.4V(51)	Solder Retention	0.8 mm	0.031 in	Gold	Receptacle Center Strip Contacts	2	24	0.4 mm	0.016 in	Surface Mount	0.8 mm

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$

Digikey	N/A	0	$ 0.56

General part information

Board to Board & Mezzanine Connectors 0.4MM FPC TO BOARD 10P RECP 0.6 HGHT

Technical documentation and resources