Integrated Circuits (ICs)

ADCMP581BCPZ-R2

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IC COMPARATOR 1 W/LATCH 16LFCSP

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Integrated Circuits (ICs)

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IC COMPARATOR 1 W/LATCH 16LFCSP

Technical Specifications

Parameters and characteristics for this part

Specification	ADCMP581BCPZ-R2

CMRR, PSRR (Typ)	75 dB, 60 dB
Current - Input Bias (Max)	30 µA
Current - Output (Typ)	44 mA
Current - Quiescent (Max) [Max]	8 mA
Hysteresis	1 mV
Mounting Type	Surface Mount
Number of Elements	1
Operating Temperature [Max]	125 °C
Operating Temperature [Min]	-40 °C
Output Type	ECL, Complementary
Package / Case	16-WFQFN Exposed Pad, CSP
Propagation Delay (Max) [Max]	0.18 ns
Supplier Device Package	16-LFCSP (3x3)
Type	with Latch
Voltage - Input Offset (Max)	10 mV
Voltage - Supply, Single/Dual (±) [Max]	5.5 V
Voltage - Supply, Single/Dual (±) [Min]	-4.5 V

Part	Voltage - Input Offset (Max)	Current - Input Bias (Max)	Package / Case	Type	Current - Output (Typ)	Mounting Type	Propagation Delay (Max) [Max]	CMRR, PSRR (Typ)	Output Type	Supplier Device Package	Operating Temperature [Max]	Operating Temperature [Min]	Current - Quiescent (Max) [Max]	Voltage - Supply, Single/Dual (±) [Min]	Voltage - Supply, Single/Dual (±) [Max]	Hysteresis	Number of Elements
Analog Devices ADCMP581BCPZ-R2	10 mV	30 µA	16-WFQFN Exposed Pad CSP	with Latch	44 mA	Surface Mount	0.18 ns	60 dB 75 dB	Complementary ECL	16-LFCSP (3x3)	125 °C	-40 °C	8 mA	-4.5 V	5.5 V	1 mV	1
Analog Devices ADCMP581BCPZ-RL7	10 mV	30 µA	16-WFQFN Exposed Pad CSP	with Latch	44 mA	Surface Mount	0.18 ns	60 dB 75 dB	Complementary ECL	16-LFCSP (3x3)	125 °C	-40 °C	8 mA	-4.5 V	5.5 V	1 mV	1
Analog Devices ADCMP581BCP-RL7
Analog Devices ADCMP581BCPZ-WP	10 mV	30 µA	16-WFQFN Exposed Pad CSP	with Latch	44 mA	Surface Mount	0.18 ns	60 dB 75 dB	Complementary ECL	16-LFCSP (3x3)	125 °C	-40 °C	8 mA	-4.5 V	5.5 V	1 mV	1

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$