Zenode.ai Logo
Beta
24-6508-212
Connectors, Interconnects

24-6508-212

Active
Aries Electronics

CONN IC DIP SOCKET 24POS GOLD

Deep-Dive with AI

Search across all available documentation for this part.

DocumentsDatasheet
24-6508-212
Connectors, Interconnects

24-6508-212

Active
Aries Electronics

CONN IC DIP SOCKET 24POS GOLD

Deep-Dive with AI

DocumentsDatasheet

Technical Specifications

Parameters and characteristics for this part

Specification24-6508-212
Contact Finish - MatingGold
Contact Finish - PostGold
Contact Finish Thickness - Mating0.76 Ám
Contact Finish Thickness - Mating30 Áin
Contact Finish Thickness - Post10 Áin
Contact Finish Thickness - Post0.25 çm
Contact Material - MatingBeryllium Copper
Contact Material - Post [custom]Brass
Current Rating (Amps)3 A
FeaturesOpen Frame
Housing MaterialPolyamide (PA46), Nylon 4/6, Glass Filled
Material Flammability RatingUL94 V-0
Mounting TypeThrough Hole
Number of Positions or Pins (Grid)24
Number of Positions or Pins (Grid) [x]12
Number of Positions or Pins (Grid) [y]2
Operating Temperature [Max]125 °C
Operating Temperature [Min]-55 C
Pitch - Mating0.1 "
Pitch - Mating2.54 mm
Pitch - Post0.1 in
Pitch - Post2.54 mm
TerminationWire Wrap
Termination Post Length0.5 in
Termination Post Length12.7 mm
TypeDIP
Type [custom]15.24 mm
Type [custom]0.6 in
PartMaterial Flammability RatingTermination Post LengthTermination Post LengthCurrent Rating (Amps)Contact Finish - MatingContact Material - MatingPitch - PostPitch - PostFeaturesOperating Temperature [Min]Operating Temperature [Max]Contact Finish Thickness - MatingContact Finish Thickness - MatingContact Material - Post [custom]Housing MaterialType [custom]Type [custom]TypeMounting TypeTerminationNumber of Positions or Pins (Grid) [x]Number of Positions or Pins (Grid) [y]Number of Positions or Pins (Grid)Pitch - MatingPitch - MatingContact Finish - PostContact Finish Thickness - PostContact Finish Thickness - PostContact Material - Post
24-6508-20
Aries Electronics
UL94 V-0
9.14 mm
0.36 in
3 A
Gold
Beryllium Copper
0.1 in
2.54 mm
Open Frame
-55 C
105 ░C
0.76 Ám
30 Áin
Brass
Polyamide (PA46)
Nylon 4/6
Glass Filled
15.24 mm
0.6 in
DIP
Through Hole
Wire Wrap
12
2
24
0.1 "
2.54 mm
Tin
200 µin
5.08 µm
24-6508-212
Aries Electronics
UL94 V-0
12.7 mm
0.5 in
3 A
Gold
Beryllium Copper
0.1 in
2.54 mm
Open Frame
-55 C
125 °C
0.76 Ám
30 Áin
Brass
Polyamide (PA46)
Nylon 4/6
Glass Filled
15.24 mm
0.6 in
DIP
Through Hole
Wire Wrap
12
2
24
0.1 "
2.54 mm
Gold
10 Áin
0.25 çm
24-6508-301
Aries Electronics
UL94 V-0
9.14 mm
0.36 in
3 A
Gold
Beryllium Copper
0.1 in
2.54 mm
Open Frame
-55 C
105 ░C
0.76 Ám
30 Áin
Brass
Polyamide (PA46)
Nylon 4/6
Glass Filled
15.24 mm
0.6 in
DIP
Through Hole
Wire Wrap
12
2
24
0.1 "
2.54 mm
Tin
200 µin
5.08 µm
24-6508-311
Aries Electronics
UL94 V-0
12.7 mm
0.5 in
3 A
Gold
Beryllium Copper
0.1 in
2.54 mm
Open Frame
-55 C
125 °C
0.76 Ám
30 Áin
Brass
Polyamide (PA46)
Nylon 4/6
Glass Filled
15.24 mm
0.6 in
DIP
Through Hole
Wire Wrap
12
2
24
0.1 "
2.54 mm
Gold
10 Áin
0.25 çm
24-6503-21
Aries Electronics
UL94 V-0
9.14 mm
0.36 in
3 A
Gold
Beryllium Copper
0.1 in
2.54 mm
Closed Frame
-55 C
125 °C
0.25 µm
10 µin
Polyamide (PA46)
Nylon 4/6
Glass Filled
15.24 mm
0.6 in
DIP
Through Hole
Wire Wrap
12
2
24
0.1 "
2.54 mm
Gold
10 Áin
0.25 çm
Phosphor Bronze
24-6503-20
Aries Electronics
UL94 V-0
9.14 mm
0.36 in
3 A
Gold
Beryllium Copper
0.1 in
2.54 mm
Closed Frame
-55 C
105 ░C
0.25 µm
10 µin
Polyamide (PA46)
Nylon 4/6
Glass Filled
15.24 mm
0.6 in
DIP
Through Hole
Wire Wrap
12
2
24
0.1 "
2.54 mm
Tin
200 µin
5.08 µm
Phosphor Bronze
24-6508-302
Aries Electronics
UL94 V-0
9.14 mm
0.36 in
3 A
Gold
Beryllium Copper
0.1 in
2.54 mm
Open Frame
-55 C
105 ░C
0.76 Ám
30 Áin
Brass
Polyamide (PA46)
Nylon 4/6
Glass Filled
15.24 mm
0.6 in
DIP
Through Hole
Wire Wrap
12
2
24
0.1 "
2.54 mm
Tin
200 µin
5.08 µm
24-6508-211
Aries Electronics
UL94 V-0
12.7 mm
0.5 in
3 A
Gold
Beryllium Copper
0.1 in
2.54 mm
Open Frame
-55 C
125 °C
0.76 Ám
30 Áin
Brass
Polyamide (PA46)
Nylon 4/6
Glass Filled
15.24 mm
0.6 in
DIP
Through Hole
Wire Wrap
12
2
24
0.1 "
2.54 mm
Gold
10 Áin
0.25 çm
24-6501-21
Aries Electronics
UL94 V-0
10.41 mm
0.41 in
1.5 A
Gold
Phosphor Bronze
0.1 in
2.54 mm
Closed Frame
-55 C
125 °C
0.25 µm
10 µin
Polyamide (PA46)
Nylon 4/6
Glass Filled
15.24 mm
0.6 in
DIP
Through Hole
Wire Wrap
12
2
24
0.1 "
2.54 mm
Gold
10 Áin
0.25 çm
Phosphor Bronze
24-6508-30
Aries Electronics
UL94 V-0
9.14 mm
0.36 in
3 A
Gold
Beryllium Copper
0.1 in
2.54 mm
Open Frame
-55 C
105 ░C
0.76 Ám
30 Áin
Brass
Polyamide (PA46)
Nylon 4/6
Glass Filled
15.24 mm
0.6 in
DIP
Through Hole
Wire Wrap
12
2
24
0.1 "
2.54 mm
Tin
200 µin
5.08 µm

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyBulk 20$ 20.63
N/A 0$ 23.88

Description

General part information

24-650 Series

24 (2 x 12) Pos DIP, 0.6" (15.24mm) Row Spacing Socket Gold Through Hole

Documents

Technical documentation and resources