Connectors, Interconnects

BM23PF0.8-14DP-0.35V(895)

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Hirose Electric Co Ltd

CONN HDR 14POS SMD GOLD

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DocumentsBM23PF0.8-14DP-0.35V(895) Spec

Connectors, Interconnects

BM23PF0.8-14DP-0.35V(895)

Active

Hirose Electric Co Ltd

CONN HDR 14POS SMD GOLD

Deep-Dive with AI

DocumentsBM23PF0.8-14DP-0.35V(895) Spec

Specifications Series Pricing Description Documents

Technical Specifications

Parameters and characteristics for this part

Specification	BM23PF0.8-14DP-0.35V(895)

Connector Type	Header, Outer Shroud Contacts
Contact Finish	Gold
Contact Finish Thickness	1.97 Áin
Contact Finish Thickness	0.05 Ám
Features	Solder Retention
Height Above Board [z]	0.63 mm
Height Above Board [z]	0.025 in
Mated Stacking Heights	0.8 mm
Mounting Type	Surface Mount
Number of Positions	14
Number of Rows [custom]	2
Pitch	0.014 in
Pitch	0.35 mm

BM23PF0.8 Series

Part	Contact Finish Thickness	Contact Finish Thickness	Number of Positions	Features	Pitch	Pitch	Connector Type	Number of Rows [custom]	Mated Stacking Heights	Contact Finish	Mounting Type	Height Above Board [z]	Height Above Board [z]
Hirose Electric Co Ltd BM23PF0.8-30DS-0.35V(895)	1.97 Áin	0.05 Ám	30	Solder Retention	0.014 in	0.35 mm	Receptacle Center Strip Contacts	2	0.8 mm	Gold	Surface Mount	0.8 mm	0.031 in
Hirose Electric Co Ltd BM23PF0.8-14DP-0.35V(895)	1.97 Áin	0.05 Ám	14	Solder Retention	0.014 in	0.35 mm	Header Outer Shroud Contacts	2	0.8 mm	Gold	Surface Mount	0.63 mm	0.025 in
Hirose Electric Co Ltd BM23PF0.8-40DP-0.35V(51)	1.97 Áin	0.05 Ám	40	Solder Retention	0.014 in	0.35 mm	Header Outer Shroud Contacts	2	0.8 mm	Gold	Surface Mount	0.63 mm	0.025 in
Hirose Electric Co Ltd BM23PF0.8-40DS-0.35V(51)	1.97 Áin	0.05 Ám	40	Solder Retention	0.014 in	0.35 mm	Receptacle Center Strip Contacts	2	0.8 mm	Gold	Surface Mount	0.8 mm	0.031 in
Hirose Electric Co Ltd BM23PF0.8-24DS-0.35V(895)	1.97 Áin	0.05 Ám	24	Solder Retention	0.014 in	0.35 mm	Receptacle Center Strip Contacts	2	0.8 mm	Gold	Surface Mount	0.8 mm	0.031 in
Hirose Electric Co Ltd BM23PF0.8-40DP-0.35V(895)	1.97 Áin	0.05 Ám	40	Solder Retention	0.014 in	0.35 mm	Header Outer Shroud Contacts	2	0.8 mm	Gold	Surface Mount	0.63 mm	0.025 in
Hirose Electric Co Ltd BM23PF0.8-30DP-0.35V(895)	1.97 Áin	0.05 Ám	30	Solder Retention	0.014 in	0.35 mm	Header Outer Shroud Contacts	2	0.8 mm	Gold	Surface Mount	0.63 mm	0.025 in
Hirose Electric Co Ltd BM23PF0.8-46DS-0.35V(51)	1.97 Áin	0.05 Ám	46	Solder Retention	0.014 in	0.35 mm	Receptacle Center Strip Contacts	2	0.8 mm	Gold	Surface Mount	0.8 mm	0.031 in
Hirose Electric Co Ltd BM23PF0.8-20DS-0.35V(51)	1.97 Áin	0.05 Ám	20	Solder Retention	0.014 in	0.35 mm	Receptacle Center Strip Contacts	2	0.8 mm	Gold	Surface Mount	0.8 mm	0.031 in
Hirose Electric Co Ltd BM23PF0.8-42DS-0.35V(51)	1.97 Áin	0.05 Ám	42	Solder Retention	0.014 in	0.35 mm	Receptacle Center Strip Contacts	2	0.8 mm	Gold	Surface Mount	0.8 mm	0.031 in

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$

Digikey	Cut Tape (CT)	1	$ 0.82
		10	$ 0.70
		25	$ 0.67
		50	$ 0.65
		100	$ 0.62
		250	$ 0.57
		500	$ 0.51
	Digi-Reel®	1	$ 0.82
		10	$ 0.70
		25	$ 0.67
		50	$ 0.65
		100	$ 0.62
		250	$ 0.57
		500	$ 0.51
	N/A	5000	$ 1.05
		11970	$ 1.05
	Tape & Reel (TR)	1000	$ 0.46

Description

General part information

BM23PF0.8 Series

14 Position Connector Header, Outer Shroud Contacts Surface Mount Gold

Documents

Technical documentation and resources

BM23PF0.8-14DP-0.35V(895) Spec

Datasheet