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R6520ENXC7G
Discrete Semiconductor Products

R6520ENXC7G

Active
Rohm Semiconductor

MOSFET SINGLE, 20A, 650V, 68W ROHS COMPLIANT: YES

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R6520ENXC7G
Discrete Semiconductor Products

R6520ENXC7G

Active
Rohm Semiconductor

MOSFET SINGLE, 20A, 650V, 68W ROHS COMPLIANT: YES

Technical Specifications

Parameters and characteristics for this part

SpecificationR6520ENXC7G
Current - Continuous Drain (Id) @ 25°C20 A
Drain to Source Voltage (Vdss)650 V
Drive Voltage (Max Rds On, Min Rds On)10 V
FET TypeN-Channel
Gate Charge (Qg) (Max) @ Vgs61 nC
Input Capacitance (Ciss) (Max) @ Vds1400 pF
Mounting TypeThrough Hole
Operating Temperature150 °C
Package / CaseTO-220-3 Full Pack
Power Dissipation (Max)68 W
Supplier Device PackageTO-220FM
TechnologyMOSFET (Metal Oxide)
Vgs (Max)20 V
Vgs(th) (Max) @ Id4 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyN/A 939$ 5.10
NewarkEach 1$ 6.21
10$ 6.20
25$ 3.31
50$ 3.17
100$ 3.04
250$ 3.03
500$ 2.57

Description

General part information

R6520ENX Series

R6520ENX is a power MOSFET with low on-resistance and fast switching, suitable for the switching application.

Documents

Technical documentation and resources

Technical Data Sheet EN

Datasheet

Example of Heat Dissipation Design for TO Packages: Effect of Heat Dissipation Materials

Thermal Design

How to Use LTspice® Models

Schematic Design & Verification

Moisture Sensitivity Level - Transistors

Package Information

About Flammability of Materials

Environmental Data

How to Create Symbols for PSpice Models

Models

R6520ENX ESD Data

Characteristics Data

What is a Thermal Model? (Transistor)

Thermal Design

Power Eco Family: Overview of ROHM's Power Semiconductor Lineup

White Paper

Basics of Thermal Resistance and Heat Dissipation

Thermal Design

Method for Monitoring Switching Waveform

Schematic Design & Verification

Inner Structure

Package Information

Anti-Whisker formation - Transistors

Package Information

θ<sub>JC</sub> and Ψ<sub>JT</sub>

Thermal Design

Method for Calculating Junction Temperature from Transient Thermal Resistance Data

Thermal Design

Two-Resistor Model for Thermal Simulation

Thermal Design

List of Transistor Package Thermal Resistance

Thermal Design

MOSFET Gate Drive Current Setting for Motor Driving

Technical Article

θ<sub>JA</sub> and Ψ<sub>JT</sub>

Thermal Design

Reliability Test Result

Manufacturing Data

Explanation for Marking

Package Information

Precautions When Measuring the Rear of the Package with a Thermocouple

Thermal Design

Importance of Probe Calibration When Measuring Power: Deskew

Schematic Design & Verification

Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)

Technical Article

MOSFET Gate Resistor Setting for Motor Driving

Technical Article

Types and Features of Transistors

Application Note

Notes for Temperature Measurement Using Thermocouples

Thermal Design

Package Dimensions

Package Information

Part Explanation

Application Note

How to Use the Thermal Resistance and Thermal Characteristics Parameters

Thermal Design

Notes for Calculating Power Consumption:Static Operation

Thermal Design

PCB Layout Thermal Design Guide

Thermal Design

Measurement Method and Usage of Thermal Resistance RthJC

Thermal Design

Temperature derating method for Safe Operating Area (SOA)

Schematic Design & Verification

Compliance of the RoHS directive

Environmental Data

Notes for Temperature Measurement Using Forward Voltage of PN Junction

Thermal Design

Judgment Criteria of Thermal Evaluation

Thermal Design

About Export Regulations

Export Information

How to Use LTspice&reg; Models: Tips for Improving Convergence

Schematic Design & Verification

Impedance Characteristics of Bypass Capacitor

Schematic Design & Verification

Calculation of Power Dissipation in Switching Circuit

Schematic Design & Verification

What Is Thermal Design

Thermal Design