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Technical Specifications
Parameters and characteristics for this part
| Specification | W25Q16DWSSAG |
|---|---|
| Access Time | 7 ns |
| Clock Frequency | 104 MHz |
| Memory Format | FLASH |
| Memory Interface | QPI, SPI - Quad I/O |
| Memory Organization [custom] | 2 M |
| Memory Organization [custom] | 8 |
| Memory Size | 2 MB |
| Memory Type | Non-Volatile |
| Mounting Type | Surface Mount |
| Operating Temperature [Max] | 105 °C |
| Operating Temperature [Min] | -40 °C |
| Package / Case | 5.3 mm, 0.209 in |
| Package / Case | 8-SOIC |
| Supplier Device Package | 8-SOIC |
| Technology | FLASH - NOR |
| Voltage - Supply [Max] | 1.95 V |
| Voltage - Supply [Min] | 1.65 V |
| Write Cycle Time - Word, Page [custom] | 40 µs |
| Write Cycle Time - Word, Page [custom] | 3 ms |
...
| Part | Package / Case | Voltage - Supply [Max] | Voltage - Supply [Min] | Operating Temperature [Min] | Operating Temperature [Max] | Memory Size | Clock Frequency | Memory Format | Write Cycle Time - Word, Page [custom] | Write Cycle Time - Word, Page [custom] | Memory Organization [custom] | Memory Organization [custom] | Mounting Type | Supplier Device Package | Technology | Memory Type | Memory Interface | Access Time | Write Cycle Time - Word, Page | Package / Case | Package / Case | Package / Case |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 Winbond Electronics | 8-UFDFN Exposed Pad | 1.95 V | 1.65 V | -40 °C | 105 °C | 2 MB | 104 MHz | FLASH | 40 µs | 3 ms | 2 M | 8 | Surface Mount | 8-USON (4x3) | FLASH - NOR | Non-Volatile | QPI SPI - Quad I/O | 7 ns | ||||
 Winbond Electronics | 8-UFDFN Exposed Pad | 3.6 V | 2.7 V | -40 ¯C | 85 C | 2 MB | 133 MHz | FLASH | 2 M | 8 | Surface Mount | 8-USON (4x3) | FLASH - NOR | Non-Volatile | SPI - Quad I/O | 3 ms | ||||||
Winbond Electronics | 8-SOIC | 1.95 V | 1.65 V | -40 °C | 125 °C | 2 MB | 133 MHz | FLASH | 2 M | 8 | Surface Mount | 8-SOIC | FLASH - NOR | Non-Volatile | DTR QPI SPI - Quad I/O | 6 ns | 3 ms | 0.209 in 5.3 mm | ||||
 Winbond Electronics | 8-DIP (0.300" 7.62mm) | 3.6 V | 2.7 V | -40 ¯C | 85 C | 2 MB | 104 MHz | FLASH | 50 µs | 3 ms | 2 M | 8 | Through Hole | 8-PDIP | FLASH - NOR | Non-Volatile | SPI - Quad I/O | |||||
 Winbond Electronics | 8-UFDFN Exposed Pad | 1.95 V | 1.65 V | -40 °C | 105 °C | 2 MB | 104 MHz | FLASH | 60 µs | 3 ms | 2 M | 8 | Surface Mount | 8-USON (2x3) | FLASH - NOR | Non-Volatile | QPI SPI - Quad I/O | 6 ns | ||||
 Winbond Electronics | 8-WDFN Exposed Pad | 1.95 V | 1.65 V | -40 °C | 125 °C | 2 MB | 133 MHz | FLASH | 2 M | 8 | Surface Mount | 8-WSON (6x5) | FLASH - NOR | Non-Volatile | DTR QPI SPI - Quad I/O | 6 ns | 3 ms | |||||
Winbond Electronics | 8-SOIC | 3.6 V | 2.7 V | -40 ¯C | 85 C | 2 MB | 104 MHz | FLASH | 50 µs | 3 ms | 2 M | 8 | Surface Mount | 8-SOIC | FLASH - NOR | Non-Volatile | SPI - Quad I/O | 0.209 in 5.3 mm | ||||
Winbond Electronics | 8-SOIC | 1.95 V | 1.65 V | -40 °C | 105 °C | 2 MB | 104 MHz | FLASH | 40 µs | 3 ms | 2 M | 8 | Surface Mount | 8-SOIC | FLASH - NOR | Non-Volatile | QPI SPI - Quad I/O | 7 ns | 0.209 in 5.3 mm | |||
Winbond Electronics | 8-SOIC | 1.95 V | 1.65 V | -40 ¯C | 85 C | 2 MB | 104 MHz | FLASH | 60 µs | 3 ms | 2 M | 8 | Surface Mount | 8-VSOP | FLASH - NOR | Non-Volatile | QPI SPI - Quad I/O | 0.154 in | 3.9 mm | |||
 Winbond Electronics | 8-SOIC | 1.95 V | 1.65 V | -40 ¯C | 85 C | 2 MB | 104 MHz | FLASH | 60 µs | 3 ms | 2 M | 8 | Surface Mount | 8-SOIC | FLASH - NOR | Non-Volatile | QPI SPI - Quad I/O | 0.154 in | 3.9 mm |
Pricing
Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly
| Distributor | Package | Quantity | $ | |
|---|---|---|---|---|
| Digikey | N/A | 0 | $ 0.00 | |
Description
General part information
W25Q16 Series
FLASH - NOR Memory IC 16Mbit SPI - Quad I/O, QPI 104 MHz 7 ns 8-SOIC
Documents
Technical documentation and resources
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