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342000F00000G
Fans, Blowers, Thermal Management

342000F00000G

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Boyd Laconia, LLC

HEAT SINKS THIN-FIN HEAT SINK FOR PCI/AGP CHIP SETS, LOW PROFILE, COPPER, 101.6X25.4X25.4MM

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342000F00000G
Fans, Blowers, Thermal Management

342000F00000G

Active
Boyd Laconia, LLC

HEAT SINKS THIN-FIN HEAT SINK FOR PCI/AGP CHIP SETS, LOW PROFILE, COPPER, 101.6X25.4X25.4MM

Deep-Dive with AI

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Specification342000F00000G
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DistributorPackageQuantity$
DigikeyN/A 0$ 4.75

Description

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Thin-Fin Style Series

Heat Sinks Thin-Fin Heat Sink for PCI/AGP Chip Sets, Low Profile, Copper, 101.6x25.4x25.4mm

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