Thin-Fin Style Series
Heat Sinks Thin-Fin Heat Sink for PCI/AGP Chip Sets, Low Profile, Copper, 101.6x25.4x25.4mm
Manufacturer: Boyd Laconia, LLC
Catalog
Heat Sinks Thin-Fin Heat Sink for PCI/AGP Chip Sets, Low Profile, Copper, 101.6x25.4x25.4mm
Heat Sinks Thin-Fin Heat Sink for PCI/AGP Chip Sets, Low Profile, Copper, 101.6x25.4x25.4mm
Heat Sinks Thin-Fin Heat Sink for PCI/AGP Chip Sets, Low Profile, Copper, 101.6x25.4x25.4mm
Heat Sinks Thin-Fin Heat Sink for PCI/AGP Chip Sets, Low Profile, Copper, 101.6x25.4x25.4mm
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Boyd Laconia, LLC |