Prototyping, Fabrication Products
18-350000-10
ActiveAries Electronics
IC & COMPONENT SOCKETS 18P SOIC/DIP SOCKET
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Documents18-350000-10 | Datasheet
Prototyping, Fabrication Products
18-350000-10
ActiveAries Electronics
IC & COMPONENT SOCKETS 18P SOIC/DIP SOCKET
Deep-Dive with AI
Documents18-350000-10 | Datasheet
Technical Specifications
Parameters and characteristics for this part
| Specification | 18-350000-10 |
|---|---|
| Board Thickness | 1.57 mm |
| Board Thickness | 0.062 " |
| Board Thickness | 0.0625 in |
| Material | FR4 Epoxy Glass |
| Number of Positions | 18 |
| Package Accepted | SOIC |
| Pitch | 0.05 in |
| Pitch | 1.27 mm |
| Proto Board Type | SMD to DIP |
| Size / Dimension [x] | 45.72 mm |
| Size / Dimension [y] | 11.43 mm |
Pricing
Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly
Description
General part information
350000 Series
IC & COMPONENT SOCKETS 18P SOIC/DIP SOCKET
Documents
Technical documentation and resources