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DocumentsThermal Management for BGAs
Deep-Dive with AI
DocumentsThermal Management for BGAs
Technical Specifications
Parameters and characteristics for this part
| Specification | 609-100AB |
|---|---|
| Attachment Method | Thermal Material, Clip |
| Fin Height | 1 in |
| Fin Height | 25.4 mm |
| Length [x] | 71.32 mm |
| Length [x] | 2.808 in |
| Material | Aluminum |
| Material Finish | Black Anodized |
| Package Cooled | LGA, CPU, ASIC, BGA |
| Shape | Rectangular, Pin Fins |
| Type | Top Mount |
| Width [x] | 1.7 in |
| Width [x] | 43.18 mm |
Pricing
Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly
| Distributor | Package | Quantity | $ | |
|---|---|---|---|---|
| Digikey | N/A | 0 | $ 0.00 | |
| 0 | $ 0.00 | |||
Description
General part information
609-100 Series
Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Aluminum Top Mount
Documents
Technical documentation and resources