Soldering, Desoldering, Rework Products
TS991SNL500T4
ActiveChip Quik Inc.
SOLDER THERMALLY STABLE SOLDER PASTE NC (NO-CLEAN) SN96.5/AG3.0/CU0.5 T4 (500G JAR)
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Soldering, Desoldering, Rework Products
TS991SNL500T4
ActiveChip Quik Inc.
SOLDER THERMALLY STABLE SOLDER PASTE NC (NO-CLEAN) SN96.5/AG3.0/CU0.5 T4 (500G JAR)
Deep-Dive with AI
DocumentsDatasheet
Technical Specifications
Parameters and characteristics for this part
| Specification | TS991SNL500T4 |
|---|---|
| Composition | Sn96.5Ag3Cu0.5 (96.5/3/0.5) |
| Flux Type | No-Clean |
| Form | 17.64 oz, 500 g |
| Form | Jar |
| Melting Point | 423 °F |
| Melting Point | 217 °C |
| Mesh Type | 4 |
| Shelf Life | 12 Months |
| Shelf Life Start | Date of Manufacture |
| Type | Solder Paste |
Pricing
Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly
Description
General part information
TS991S Series
Lead Free No-Clean Solder Paste Sn96.5Ag3Cu0.5 (96.5/3/0.5) Jar, 17.64 oz (500g)
Documents
Technical documentation and resources
