TS991S Series
Manufacturer: Chip Quik Inc.
Beta
⌘K
SOLDER THERMALLY STABLE SOLDER PASTE NC (NO-CLEAN) SN96.5/AG3.0/CU0.5 T4 (500G JAR)
| Part | Melting Point | Melting Point | Flux Type | Type | Mesh Type | Composition | Shelf Life Start | Form | Form | Shelf Life | Mesh Type |
|---|---|---|---|---|---|---|---|---|---|---|---|
 Chip Quik Inc. | 423 °F | 217 °C | No-Clean | Solder Paste | 4 | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Date of Manufacture | 17.64 oz 500 g | Jar | 12 Months | |
 Chip Quik Inc. | 423 °F | 217 °C | No-Clean | Solder Paste | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Date of Manufacture | 17.64 oz 500 g | Jar | 12 Months | 3 |