Connectors, Interconnects

13-0518-11

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CONN SOCKET SIP 13POS GOLD

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Connectors, Interconnects

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CONN SOCKET SIP 13POS GOLD

Technical Specifications

Parameters and characteristics for this part

Specification	13-0518-11

Contact Finish - Mating	Gold
Contact Finish - Post	Gold
Contact Finish Thickness - Mating	0.25 µm
Contact Finish Thickness - Mating	10 µin
Contact Finish Thickness - Post	10 Áin
Contact Finish Thickness - Post	0.25 çm
Contact Material - Mating	Beryllium Copper
Contact Material - Post [custom]	Brass
Current Rating (Amps)	3 A
Features	Open Frame
Housing Material	Polyamide (PA46), Nylon 4/6, Glass Filled
Material Flammability Rating	UL94 V-0
Mounting Type	Through Hole
Number of Positions or Pins (Grid) [custom]	13
Number of Positions or Pins (Grid) [x]	1
Number of Positions or Pins (Grid) [y]	13
Pitch - Mating	0.1 "
Pitch - Mating	2.54 mm
Pitch - Post	0.1 in
Pitch - Post	2.54 mm
Termination	Solder
Termination Post Length	0.125 in
Termination Post Length	3.18 mm
Type	SIP

Part	Termination Post Length	Termination Post Length	Current Rating (Amps)	Material Flammability Rating	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Type	Contact Material - Mating	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Mounting Type	Contact Finish - Post	Pitch - Post	Pitch - Post	Pitch - Mating	Pitch - Mating	Housing Material	Features	Contact Material - Post [custom]	Contact Finish - Mating	Termination	Number of Positions or Pins (Grid) [y]	Number of Positions or Pins (Grid) [custom]	Number of Positions or Pins (Grid) [x]
Aries Electronics 13-0518-10H	0.125 in	3.18 mm	3 A	UL94 V-0	0.25 µm	10 µin	SIP	Beryllium Copper	200 µin	5.08 µm	Through Hole	Tin	0.1 in	2.54 mm	0.1 "	2.54 mm	Polyamide (PA46) Nylon 4/6 Glass Filled	Open Frame	Brass	Gold	Solder	13	13	1
Aries Electronics 13-0518-00	0.046 in	1.17 mm	3 A	UL94 V-0	0.25 µm	10 µin	SIP	Beryllium Copper	200 µin	5.08 µm	Surface Mount	Tin	0.1 in	2.54 mm	0.1 "	2.54 mm	Polyamide (PA46) Nylon 4/6 Glass Filled	Open Frame	Brass	Gold	Solder	13	13	1
Aries Electronics 13-0518-11	0.125 in	3.18 mm	3 A	UL94 V-0	0.25 µm	10 µin	SIP	Beryllium Copper	10 Áin	0.25 çm	Through Hole	Gold	0.1 in	2.54 mm	0.1 "	2.54 mm	Polyamide (PA46) Nylon 4/6 Glass Filled	Open Frame	Brass	Gold	Solder	13	13	1

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

General part information

13 (1 x 13) Pos SIP Socket Gold Through Hole

Technical documentation and resources