Connectors, Interconnects

1110087

Active

IC & COMPONENT SOCKETS 114P VQFP TO PGA ADAPTER

Search across all available documentation for this part.

Connectors, Interconnects

Active

IC & COMPONENT SOCKETS 114P VQFP TO PGA ADAPTER

Technical Specifications

Parameters and characteristics for this part

Specification	1110087

Board Material	FR4 Epoxy Glass
Contact Finish - Mating	Gold
Contact Finish - Post	Tin-Lead
Contact Finish Thickness - Post	200 µin
Contact Finish Thickness - Post	5.08 µm
Contact Material - Post [custom]	Brass
Convert From (Adapter End)	VQFP
Convert To (Adapter End)	PGA
Mounting Type	Through Hole
Number of Pins	144 pins
Operating Temperature	105 C
Pitch - Mating	0.5 mm
Pitch - Mating	0.02 in
Pitch - Post	0.1 in
Pitch - Post	2.54 mm
Termination	Solder
Termination Post Length	0.125 in
Termination Post Length	3.18 mm

Part	Termination Post Length	Termination Post Length	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Operating Temperature	Contact Material - Post [custom]	Convert From (Adapter End)	Termination	Contact Finish - Mating	Pitch - Post	Pitch - Post	Pitch - Mating	Pitch - Mating	Convert To (Adapter End)	Mounting Type	Number of Pins	Board Material	Contact Finish - Post
Aries Electronics 1110087	0.125 in	3.18 mm	200 µin	5.08 µm	105 C	Brass	VQFP	Solder	Gold	0.1 in	2.54 mm	0.5 mm	0.02 in	PGA	Through Hole	144 pins	FR4 Epoxy Glass	Tin-Lead

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

General part information

IC Socket Adapter VQFP To PGA Through Hole

Technical documentation and resources

No documents available