RF and Wireless

67BCS2004002008R00

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EMI GASKETS, SHEETS, ABSORBERS & SHIELDING SP,CON,C,SN,TNR

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RF and Wireless

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EMI GASKETS, SHEETS, ABSORBERS & SHIELDING SP,CON,C,SN,TNR

Technical Specifications

Parameters and characteristics for this part

EMI Gaskets, Sheets, Absorbers & Shielding SP,CON,S,AU,TNR

Part	Height	Height	Length [x]	Length [x]	Width [x]	Width [x]	Type	Operating Temperature [Max]	Operating Temperature [Min]	Attachment Method	Shape	Material	Shelf Life	Storage/Refrigeration Temperature [Max]	Storage/Refrigeration Temperature [Max]	Storage/Refrigeration Temperature [Min]	Storage/Refrigeration Temperature [Min]	Plating	Height [z]	Height [z]	Length	Length	Width	Width
Laird Technologies EMI 67SLG100150100PI00	0.591 in	15 mm	0.394 in	10 mm	10 mm	0.394 "	Film Over Foam	70 °C	-40 C	Solder	Rectangle	Polyurethane Foam Tin-Copper Polyester (SN/CU)
Laird Technologies EMI 67B3G2504810010R00					2.5 mm	0.098 in	Fingerstock			Solder		Beryllium Copper	12 Months	77 °F	77 F	10 C	50 F	Gold	10 mm	0.394 in	4.8 mm	0.189 in
Laird Technologies EMI 67BCS2003802008R00	0.079 in	2 mm	0.15 in				Shield Finger					Beryllium Copper						Nickel			3.8 mm		0.079 "	2 mm
Laird Technologies EMI 67SLG050050030PI00			0.118 in	3 mm	5 mm	0.197 in	Film Over Foam	70 °C	-40 C	Solder	Rectangle	Polyurethane Foam Tin-Copper Polyester (SN/CU)							5 mm	0.197 in
Laird Technologies EMI 67SLH060080070PI00					6 mm	0.236 in	Film Over Foam	70 °C	-40 C	Solder		Polyurethane Foam Tin-Copper Polyester (SN/CU)							8 mm	0.315 in	7 mm	0.276 in
Laird Technologies EMI 67SLH060080060PI00			0.236 in	6 mm	6 mm	0.236 in	Film Over Foam	70 °C	-40 C			Tin-Copper Polyester (SN/CU)							8 mm	0.315 in
Laird Technologies EMI 67BCG2504303510R00	0.138 in	3.5 mm			2.5 mm	0.098 in	Fingerstock			Solder		Beryllium Copper	12 Months	77 °F	77 F	10 C	50 F	Gold			4.3 mm	0.169 "
Laird Technologies EMI 67BCS2004002008R00	0.079 in	2 mm					Shield Finger					Beryllium Copper						Nickel			4 mm	0.157 "	0.079 "	2 mm

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EMI Gaskets, Sheets, Absorbers & Shielding SP,CON,S,AU,TNR

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