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ST33KTPM2I3WBZA9
Integrated Circuits (ICs)

ST33KTPM2I3WBZA9

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STMicroelectronics

TPM 2.0 DEVICE FOR INDUSTRIAL DEVICES

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DocumentsTN1330+5
ST33KTPM2I3WBZA9
Integrated Circuits (ICs)

ST33KTPM2I3WBZA9

Active
STMicroelectronics

TPM 2.0 DEVICE FOR INDUSTRIAL DEVICES

Deep-Dive with AI

DocumentsTN1330+5

Technical Specifications

Parameters and characteristics for this part

SpecificationST33KTPM2I3WBZA9
ApplicationsTrusted Platform Module (TPM)
Controller SeriesST33K
Core ProcessorARM® SecurCore® SC300
InterfaceSPI, I2C
Mounting TypeWettable Flank, Surface Mount
Number of I/O7
Operating Temperature [Max]105 °C
Operating Temperature [Min]-40 °C
Package / Case32-UFQFN Exposed Pad
Supplier Device Package32-UFQFPN (5x5)
Voltage - Supply3.3 V, 1.8 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyN/A 0$ 2.70

Description

General part information

ST33KTPM2I Series

The STSAFE-TPM (trusted platform module) family of products offers a broad portfolio of standardized solutions for embedded, PC, mobile, and computing applications. STSAFE is an ST trademark.

It includes turnkey products compliant with the trusted computing group (TCG) standards that provide services to protect the confidentiality, integrity and authenticity of information and devices.

These devices are easy to integrate thanks to the variety of supported interfaces and the availability of TPM ecosystem software solutions.