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STMICROELECTRONICS L4941BDT-TR
Discrete Semiconductor Products

R6511KNJTL

Active
Rohm Semiconductor

650V 11A TO-263, HIGH-SPEED SWITCHING POWER MOSFET

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STMICROELECTRONICS L4941BDT-TR
Discrete Semiconductor Products

R6511KNJTL

Active
Rohm Semiconductor

650V 11A TO-263, HIGH-SPEED SWITCHING POWER MOSFET

Technical Specifications

Parameters and characteristics for this part

SpecificationR6511KNJTL
Current - Continuous Drain (Id) @ 25°C11 A
Drain to Source Voltage (Vdss)650 V
Drive Voltage (Max Rds On, Min Rds On)10 V
FET TypeN-Channel
Gate Charge (Qg) (Max) @ Vgs [Max]22 nC
Mounting TypeSurface Mount
Operating Temperature150 °C
Package / CaseD2PAK (2 Leads + Tab), TO-263-3, TO-263AB
Power Dissipation (Max)124 W
Rds On (Max) @ Id, Vgs400 mOhm
Supplier Device PackageLPTS
TechnologyMOSFET (Metal Oxide)
Vgs (Max)20 V
Vgs(th) (Max) @ Id5 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyN/A 0$ 1.85
NewarkEach (Supplied on Cut Tape) 1$ 5.00
10$ 3.39
25$ 3.38
50$ 3.37
100$ 3.35
250$ 3.17
500$ 2.98
1000$ 2.08

Description

General part information

R6511KNJ Series

R6511KNJ is a power MOSFET with low on-resistance and fast switching, suitable for the switching application.

Documents

Technical documentation and resources

Technical Data Sheet EN

Datasheet

Two-Resistor Model for Thermal Simulation

Thermal Design

Anti-Whisker formation - Transistors

Package Information

R6511KNJ Data Sheet

Data Sheet

How to Use the Thermal Resistance and Thermal Characteristics Parameters

Thermal Design

Judgment Criteria of Thermal Evaluation

Thermal Design

Report of SVHC under REACH Regulation

Environmental Data

About Export Regulations

Export Information

Method for Monitoring Switching Waveform

Schematic Design & Verification

What is a Thermal Model? (Transistor)

Thermal Design

Condition of Soldering / Land Pattern Reference

Package Information

R6511KNJ ESD Data

Characteristics Data

Notes for Temperature Measurement Using Forward Voltage of PN Junction

Thermal Design

Taping Information

Package Information

θ<sub>JA</sub> and Ψ<sub>JT</sub>

Thermal Design

How to Use LTspice&reg; Models: Tips for Improving Convergence

Schematic Design & Verification

Temperature derating method for Safe Operating Area (SOA)

Schematic Design & Verification

MOSFET Gate Drive Current Setting for Motor Driving

Technical Article

Moisture Sensitivity Level - Transistors

Package Information

Inner Structure

Package Information

Types and Features of Transistors

Application Note

Notes for Temperature Measurement Using Thermocouples

Thermal Design

Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)

Technical Article

Package Dimensions

Package Information

Part Explanation

Application Note

Basics of Thermal Resistance and Heat Dissipation

Thermal Design

Reliability Test Result

Manufacturing Data

MOSFET Gate Resistor Setting for Motor Driving

Technical Article

Measurement Method and Usage of Thermal Resistance RthJC

Thermal Design

Calculation of Power Dissipation in Switching Circuit

Schematic Design & Verification

Notes for Calculating Power Consumption:Static Operation

Thermal Design

List of Transistor Package Thermal Resistance

Thermal Design

Impedance Characteristics of Bypass Capacitor

Schematic Design & Verification

θ<sub>JC</sub> and Ψ<sub>JT</sub>

Thermal Design

Method for Calculating Junction Temperature from Transient Thermal Resistance Data

Thermal Design

Power Eco Family: Overview of ROHM's Power Semiconductor Lineup

White Paper

How to Create Symbols for PSpice Models

Models

How to Use LTspice&reg; Models

Schematic Design & Verification

PCB Layout Thermal Design Guide

Thermal Design

Importance of Probe Calibration When Measuring Power: Deskew

Schematic Design & Verification

What Is Thermal Design

Thermal Design

Explanation for Marking

Package Information

Compliance of the RoHS directive

Environmental Data

About Flammability of Materials

Environmental Data

Precautions When Measuring the Rear of the Package with a Thermocouple

Thermal Design