Soldering, Desoldering, Rework Products

CQ100GE 35G

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GERMANIUM DOPED SOLDER PASTE NO-

Soldering, Desoldering, Rework Products

Active

GERMANIUM DOPED SOLDER PASTE NO-

Technical Specifications

Parameters and characteristics for this part

Specification	CQ100GE 35G

Composition Elements	Ge, Sn, Cu, Ni
Composition Formula	Sn99.244Cu0.7
Cu Composition	0.7 %
Form	Syringe
Form Volume	10 cc
Form Weight	1.23 oz
Melting Point	441 °F
Mesh Type	4
Ni Composition	0.05 %
Process	Lead Free
Shelf Life	6 Months
Shelf Life Start	Date of Manufacture
Sn Composition	99.244 %
Storage/Refrigeration Temperature (Maximum)	46 °F
Storage/Refrigeration Temperature (Minimum)	37 °F
Type	Solder Paste

Part	Shipping Info	Type	Composition Elements	Composition Formula	Cu Composition	Sn Composition	Ni Composition	Mesh Type	Melting Point	Shelf Life	Process	Shelf Life Start	Form	Form Weight	Storage/Refrigeration Temperature (Maximum)	Storage/Refrigeration Temperature (Minimum)	Diameter	Form Volume
Chip Quik Inc. CQ100GE 250G	Ships with Cold Pack. To ensure customer satisfaction and product integrity air shipment is recommended.	Solder Paste	Cu Ge Ni Sn	Sn99.244Cu0.7	0.7 %	99.244 %	0.05 %	4	441 °F	6 Months	Lead Free	Date of Manufacture	Jar	8.8 oz	46 °F	37 °F
Chip Quik Inc. CQ100GE.031 1LB		Wire Solder	Cu Ge Ni Sn	Sn99.244Cu0.7	0.7 %	99.244 %	0.05 %		441 °F		Lead Free		Spool	1 lb			0.031 in
Chip Quik Inc. CQ100GE.020 1LB		Wire Solder	Cu Ge Ni Sn	Sn99.244Cu0.7	0.7 %	99.244 %	0.05 %		441 °F		Lead Free		Spool	1 lb			0.02 in
Chip Quik Inc. CQ100GE		Bar Solder	Cu Ge Ni Sn	Sn99.244Cu0.7	0.7 %	99.244 %	0.05 %		441 °F		Lead Free		Bar	1 lb
Chip Quik Inc. CQ100GE 35G		Solder Paste	Cu Ge Ni Sn	Sn99.244Cu0.7	0.7 %	99.244 %	0.05 %	4	441 °F	6 Months	Lead Free	Date of Manufacture	Syringe	1.23 oz	46 °F	37 °F		10 cc

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$	Updated

Digikey	Bulk	1	$ 28.95	<6d

3D models and CAD resources for this part

General part information

Lead Free No-Clean Solder Paste Sn99.244Cu0.7 (Ni0.05/Ge0.006) Syringe, 1.23 oz (35g), 10cc

Technical documentation and resources