Soldering, Desoldering, Rework Products

CQ100GE 35G

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GERMANIUM DOPED SOLDER PASTE NO-

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Soldering, Desoldering, Rework Products

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GERMANIUM DOPED SOLDER PASTE NO-

Technical Specifications

Parameters and characteristics for this part

Part	Shipping Info	Type	Composition	Mesh Type	Melting Point	Melting Point	Shelf Life	Flux Type	Shelf Life Start	Form	Form	Form	Diameter [diameter]	Diameter [diameter]
Chip Quik Inc. CQ100GE 250G	Ships with Cold Pack. To ensure customer satisfaction and product integrity air shipment is recommended.	Solder Paste	0.006 0.05 0.7 99.244	4	441 °F	227 °C	6 Months	No-Clean	Date of Manufacture	8.8 oz	Jar	250 g
Chip Quik Inc. CQ100GE.031 1LB		Wire Solder	0.006 0.05 0.7 99.244		441 °F	227 °C		No-Clean			Spool	1 lb 454 g
Chip Quik Inc. CQ100GE.020 1LB		Wire Solder	0.006 0.05 0.7 99.244		441 °F	227 °C		No-Clean			Spool	1 lb 454 g	0.02 in	0.51 mm
Chip Quik Inc. CQ100GE		Bar Solder	0.006 0.05 0.7 99.244		441 °F	227 °C				1 lb	Bar	454 g
Chip Quik Inc. CQ100GE 35G		Solder Paste	0.006 0.05 0.7 99.244	4	441 °F	227 °C	6 Months	No-Clean	Date of Manufacture	1.23 oz 10 cc	Syringe	35 g

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

General part information

Lead Free No-Clean Solder Paste Sn99.244Cu0.7 (Ni0.05/Ge0.006) Syringe, 1.23 oz (35g), 10cc

Technical documentation and resources