CQ100G Series
Manufacturer: Chip Quik Inc.
Beta
⌘K
GERMANIUM DOPED SOLDER PASTE NO-
| Part | Shipping Info | Type | Composition | Mesh Type | Melting Point | Melting Point | Shelf Life | Flux Type | Shelf Life Start | Form | Form | Form | Diameter [diameter] | Diameter [diameter] |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 Chip Quik Inc. | Ships with Cold Pack. To ensure customer satisfaction and product integrity air shipment is recommended. | Solder Paste | 0.006 0.05 0.7 99.244 | 4 | 441 °F | 227 °C | 6 Months | No-Clean | Date of Manufacture | 8.8 oz | Jar | 250 g | ||
 Chip Quik Inc. | Wire Solder | 0.006 0.05 0.7 99.244 | 441 °F | 227 °C | No-Clean | Spool | 1 lb 454 g | |||||||
 Chip Quik Inc. | Wire Solder | 0.006 0.05 0.7 99.244 | 441 °F | 227 °C | No-Clean | Spool | 1 lb 454 g | 0.02 in | 0.51 mm | |||||
 Chip Quik Inc. | Bar Solder | 0.006 0.05 0.7 99.244 | 441 °F | 227 °C | 1 lb | Bar | 454 g | |||||||
 Chip Quik Inc. | Solder Paste | 0.006 0.05 0.7 99.244 | 4 | 441 °F | 227 °C | 6 Months | No-Clean | Date of Manufacture | 1.23 oz 10 cc | Syringe | 35 g |