RF and Wireless

BMI-C-001-SN

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EMI GASKETS, SHEETS, ABSORBERS & SHIELDING SP,CON,S,SN,TNR SP,CON,S,SN,TNR

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RF and Wireless

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EMI GASKETS, SHEETS, ABSORBERS & SHIELDING SP,CON,S,SN,TNR SP,CON,S,SN,TNR

Technical Specifications

Parameters and characteristics for this part

Specification	BMI-C-001-SN

Attachment Method	Solder
Height	0.096 in
Height	2.44 mm
Length	0.122 in
Length	3.11 mm
Material	Beryllium Copper
Plating	Tin
Shelf Life	12 Months
Storage/Refrigeration Temperature [Max]	77 °F
Storage/Refrigeration Temperature [Max]	77 F
Storage/Refrigeration Temperature [Min]	10 C
Storage/Refrigeration Temperature [Min]	50 F
Type	Shield Finger
Width	0.079 "
Width	2 mm

Part	Shelf Life	Storage/Refrigeration Temperature [Max]	Storage/Refrigeration Temperature [Max]	Storage/Refrigeration Temperature [Min]	Storage/Refrigeration Temperature [Min]	Width	Width	Material	Type	Height	Height	Length	Length	Attachment Method	Plating
Laird Technologies EMI BMI-C-001-SN	12 Months	77 °F	77 F	10 C	50 F	0.079 "	2 mm	Beryllium Copper	Shield Finger	0.096 in	2.44 mm	0.122 in	3.11 mm	Solder	Tin

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General part information

EMI GASKETS, SHEETS, ABSORBERS & SHIELDING SP,CON,S,SN,TNR SP,CON,S,SN,TNR

Technical documentation and resources